Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
M8340104K1002FCD03 Vishay / Dale	RES ARRAY 5 RES 10K OHM 6SIP	0
MDP160322R0GE04 Vishay / Dale	RES ARRAY 8 RES 22 OHM 16DIP	0
MSP10C011M00GEJ Vishay / Dale	RES ARRAY 9 RES 1M OHM 10SIP	0
CSC10A0115K0FPA Vishay / Dale	RES ARRAY 9 RES 15K OHM 10SIP	0
SOMC14014K75FEA Vishay / Dale	RES ARRAY 13 RES 4.75KOHM 14SOIC	0
CRA06S04313R0JTA Vishay / Dale	RES ARRAY 2 RES 13 OHM 0606	0
SOMC16016K80GEA Vishay / Dale	RES ARRAY 15 RES 6.8K OHM 16SOIC	0
SOMC1401110RGEA Vishay / Dale	RES ARRAY 13 RES 110 OHM 14SOIC	0
CRA06P083620RJTA Vishay / Dale	RES ARRAY 4 RES 620 OHM 1206	0
CRA06S0832K20FTA Vishay / Dale	RES ARRAY 4 RES 2.2K OHM 1206	725
CRA06S04318R0JTA Vishay / Dale	RES ARRAY 2 RES 18 OHM 0606	0
SOMC160118K0GEA Vishay / Dale	RES ARRAY 15 RES 18K OHM 16SOIC	0
SOMC16032K70GEA Vishay / Dale	RES ARRAY 8 RES 2.7K OHM 16SOIC	0
CSC09A0122K0GPA Vishay / Dale	RES ARRAY 8 RES 22K OHM 9SIP	0
M8340109K3301GCD03 Vishay / Dale	RES ARRAY 9 RES 3.3K OHM 10SIP	0
CSC05A0110K0GEK Vishay / Dale	RES ARRAY 4 RES 10K OHM 5SIP	1644
MDP1603180KGE04 Vishay / Dale	RES ARRAY 8 RES 180K OHM 16DIP	0
SOMC20012K00JEA Vishay / Dale	RES ARRAY 19 RES 2K OHM 20SOIC	0
MDP1403150RGE04 Vishay / Dale	RES ARRAY 7 RES 150 OHM 14DIP	470
CSC06A01390RGPA Vishay / Dale	RES ARRAY 5 RES 390 OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages