Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CN34J331CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 330 OHM	45000
CN22J153CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X2 5% 15K OHM	20000
CN34J394CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 390K OHM	0
CNP34D2201CT-50 CAL-CHIP ELECTRONICS INC.	TFA 0603X4 .5% 2.2K OHM 50P	35000
CN34J511CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 510 OHM	320000
CN34J303CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 30K OHM	0
CN34F56R0CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 56 OHM	0
CN22F22R1CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X2 1% 22.1 OHM	890000
CN34J114CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 110K OHM	0
CN34J431CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 430 OHM	0
CN34F1800CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 180 OHM	5000
CN34J131CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 130 OHM	165000
CN34J203CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 20K OHM	65000
CN24J561CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 560 OHM	80000
CN24J680CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 68 OHM	0
CN24J150CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 15 OHM	0
CN24F4751CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 1% 4.75K OHM	70000
CN24J300CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 30 OHM	0
CN34F15R0CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 15.0 OHM	210000
CN24F15R0CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 1% 15.0 OHM	10000

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages