Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CN34J274CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 270K OHM	0
CN24J200CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 20 OHM	100000
CN34F4701CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 4.70K OHM	90000
CN24J360CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 36 OHM	100000
CN34J222CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 2.2K OHM	85000
CN34J224CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 220K OHM	80000
CN34J333CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 33K OHM	40000
CN24F1000CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 1% 100 OHM	60000
CN22F75R0CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X2 1% 75.0 OHM	30000
CN34J750CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 75 OHM	35000
CN34J470CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 47 OHM	190000
CN22J102CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X2 5% 1K OHM	20000
CN34F3300CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 330 OHM	55000
CN34J270CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 27 OHM	425000
CN24J333CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 33K OHM	180000
CN24F47R5CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 1% 47.5 OHM	50000
CN34J5R1CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 5.1 OHM	50000
CN24J222CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 2.2K OHM	90000
CN24J180CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 18 OHM	240000
CN24J101CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 100 OHM	20000

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages