Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CN34J221CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 220 OHM	105000
CN34J240CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 24 OHM	435000
CN22J180CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X2 5% 18 OHM	320000
CNP34D1002CT-50 CAL-CHIP ELECTRONICS INC.	TFA 0603X4 .5% 10K OHM 50P	0
CN34F1000CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 100 OHM	50000
CN24J334CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 330K OHM	30000
CNP34D47R0CT-50 CAL-CHIP ELECTRONICS INC.	TFA 0603X4 .5% 47 OHM 50P	60000
CN34J124CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 120K OHM	0
CN34F1502CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 15K OHM	15000
CN24J104CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 100K OHM	350000
CN34J132CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 1.3K OHM	0
CN24F8251CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 1% 8.25K OHM	40000
CN34J513CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 51K OHM	0
CN34J223CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 22K OHM	15000
CN34J201CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 200 OHM	0
CNP34D2202CT-25 CAL-CHIP ELECTRONICS INC.	TFA 0603X4 .5% 22K OHM 25P	0
CN24J330CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 33 OHM	150000
CN24F56R2CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 1% 56.2 OHM	190000
CN24J512CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X4 5% 5.1 OHM	70000
CN34F1002CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 10K OHM	75000

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages