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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RACF324DJT15R0

RACF324DJT15R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15 OHM 2010

0
RACF164DJT1K30

RACF164DJT1K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.3K OHM 1206

0
RACF164DJT15R0

RACF164DJT15R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15 OHM 1206

0
RACF164DJT750R

RACF164DJT750R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 750 OHM 1206

0
RACF164DJT12K0

RACF164DJT12K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 12K OHM 1206

0
RACF648NJT220K

RACF648NJT220K

Stackpole Electronics, Inc.

RES ARRAY 8 RES 220K OHM 2512

0
RACF164DJT47K0

RACF164DJT47K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 47K OHM 1206

0
RACF408MJT47R0

RACF408MJT47R0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 47 OHM 1608

0
RACF324DJT10K0

RACF324DJT10K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10K OHM 2010

8000
RACF324DJT5K60

RACF324DJT5K60

Stackpole Electronics, Inc.

RES ARRAY 4 RES 5.6K OHM 2010

0
RACF408MJT1K00

RACF408MJT1K00

Stackpole Electronics, Inc.

RES ARRAY 8 RES 1K OHM 1608

0
RACF648RJT100K

RACF648RJT100K

Stackpole Electronics, Inc.

RES ARRAY 8 RES 100K OHM 2512

0
RACF164DFT39K2

RACF164DFT39K2

Stackpole Electronics, Inc.

RES ARRAY 4 RES 39.2K OHM 1206

0
RACF164DJT680R

RACF164DJT680R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 680 OHM 1206

0
RACF324DJT33R0

RACF324DJT33R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33 OHM 2010

0
RACF164DJT16K0

RACF164DJT16K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 16K OHM 1206

0
RACF164DGT33K0

RACF164DGT33K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33K OHM 1206

0
RACF164DFT2K00

RACF164DFT2K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2K OHM 1206

0
RACF164DJT13K0

RACF164DJT13K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 13K OHM 1206

0
RACF324DJT47K0

RACF324DJT47K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 47K OHM 2010

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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