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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RACF164DJT1K20

RACF164DJT1K20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.2K OHM 1206

0
RACF164DJT180R

RACF164DJT180R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 180 OHM 1206

0
RACF164DJT75K0

RACF164DJT75K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 75K OHM 1206

0
RACF324DJT10R0

RACF324DJT10R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10 OHM 2010

0
RACF164DJT82K0

RACF164DJT82K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 82K OHM 1206

0
RACF408MJT220K

RACF408MJT220K

Stackpole Electronics, Inc.

RES ARRAY 8 RES 220K OHM 1608

0
RACF164DJT100K

RACF164DJT100K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100K OHM 1206

0
RACF648RJT4K70

RACF648RJT4K70

Stackpole Electronics, Inc.

RES ARRAY 8 RES 4.7K OHM 2512

0
RACF164DJT33R0

RACF164DJT33R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33 OHM 1206

0
RACF164DJT36R0

RACF164DJT36R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 36 OHM 1206

0
RACF164DJT15K0

RACF164DJT15K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15K OHM 1206

885000
RACF164DJT30R0

RACF164DJT30R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 30 OHM 1206

0
RACF164DJT620K

RACF164DJT620K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 620K OHM 1206

0
RACF164DFT64K9

RACF164DFT64K9

Stackpole Electronics, Inc.

RES ARRAY 4 RES 64.9K OHM 1206

0
RACF164DJT620R

RACF164DJT620R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 620 OHM 1206

0
RACF164DJT910R

RACF164DJT910R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 910 OHM 1206

0
RACF164DJT6K80

RACF164DJT6K80

Stackpole Electronics, Inc.

RES ARRAY 4 RES 6.8K OHM 1206

0
RACF164DJT51K0

RACF164DJT51K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 51K OHM 1206

0
RACF164DJT24R0

RACF164DJT24R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 24 OHM 1206

0
RACF164DJT200K

RACF164DJT200K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 200K OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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