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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RACF164DFT8K25

RACF164DFT8K25

Stackpole Electronics, Inc.

RES ARRAY 4 RES 8.25K OHM 1206

0
RACF164DJT33K0

RACF164DJT33K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33K OHM 1206

0
RACF164DJT68K0

RACF164DJT68K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 68K OHM 1206

0
RACF164DGT150R

RACF164DGT150R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 150 OHM 1206

0
RACF164DJT470K

RACF164DJT470K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 470K OHM 1206

0
RACF164DGT330R

RACF164DGT330R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 330 OHM 1206

0
RACF164DJT390R

RACF164DJT390R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 390 OHM 1206

0
RACF164DFT100K

RACF164DFT100K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100K OHM 1206

35000
RACF648RJT15K0

RACF648RJT15K0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 15K OHM 2512

0
RACF648NJT130R

RACF648NJT130R

Stackpole Electronics, Inc.

RES ARRAY 8 RES 130 OHM 2512

0
RACF324DJT68K0

RACF324DJT68K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 68K OHM 2010

0
RACF164DJT4K30

RACF164DJT4K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.3K OHM 1206

0
RACF164DJT18R0

RACF164DJT18R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 18 OHM 1206

0
RACF324DJT1K80

RACF324DJT1K80

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.8K OHM 2010

0
RACF164DFT20K0

RACF164DFT20K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 20K OHM 1206

0
RACF164DJT2R00

RACF164DJT2R00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2 OHM 1206

0
RACF164DJT270R

RACF164DJT270R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 270 OHM 1206

0
RACF324DJT1K00

RACF324DJT1K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1K OHM 2010

0
RACF164DFT68K1

RACF164DFT68K1

Stackpole Electronics, Inc.

RES ARRAY 4 RES 68.1K OHM 1206

0
RACF408MJT10K0

RACF408MJT10K0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 10K OHM 1608

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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