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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF164DFT1K10

RAVF164DFT1K10

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.1K OHM 1206

0
RAVF104DJT680K

RAVF104DJT680K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 680K OHM 0804

0
RAVF052DJT10R0

RAVF052DJT10R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 100 OHM 0302

0
RAVF102DJT430R

RAVF102DJT430R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 430 OHM 0404

0
RACF164DJT1K50

RACF164DJT1K50

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.5K OHM 1206

0
RAVF164DFT270R

RAVF164DFT270R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 270 OHM 1206

0
RAVF164DFT15R0

RAVF164DFT15R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15 OHM 1206

0
RAVF164DJT910R

RAVF164DJT910R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 910 OHM 1206

0
RAVF104DFT30R0

RAVF104DFT30R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 30 OHM 0804

0
RAVF104DFT110R

RAVF104DFT110R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 110 OHM 0804

0
RAVF164DFT910K

RAVF164DFT910K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 910K OHM 1206

0
RAVF104DFT5K10

RAVF104DFT5K10

Stackpole Electronics, Inc.

RES ARRAY 4 RES 5.1K OHM 0804

0
RAVF164DJT33K0

RAVF164DJT33K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 33K OHM 1206

0
RAVF164DFT360R

RAVF164DFT360R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 360 OHM 1206

0
RAVF164DFT10K0

RAVF164DFT10K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10K OHM 1206

130000
RAVF164DJT130K

RAVF164DJT130K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 130K OHM 1206

0
RAVF104DJT3K90

RAVF104DJT3K90

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.9K OHM 0804

0
RAVF102DJT13R0

RAVF102DJT13R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 13 OHM 0404

0
RAVF104DFT760K

RAVF104DFT760K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 760K OHM 0804

0
RAVF324DJT100R

RAVF324DJT100R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100 OHM 2012

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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