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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF104DJT11R0

RAVF104DJT11R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 11 OHM 0804

0
RAVF104DJT75R0

RAVF104DJT75R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 75 OHM 0804

0
RAVF164DJT3K30

RAVF164DJT3K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.3K OHM 1206

0
RAVF164DFT16K0

RAVF164DFT16K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 16K OHM 1206

0
RAVF324DJT120R

RAVF324DJT120R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 120 OHM 2012

0
RAVF164DJT4R70

RAVF164DJT4R70

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.7 OHM 1206

0
RAVF104DFT7K60

RAVF104DFT7K60

Stackpole Electronics, Inc.

RES ARRAY 4 RES 7.6K OHM 0804

0
RAVF104DFT43R0

RAVF104DFT43R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 43 OHM 0804

0
RAVF104DFT1K10

RAVF104DFT1K10

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.1K OHM 0804

0
RACF324DJT100R

RACF324DJT100R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100 OHM 2010

0
RAVF164DFT36R0

RAVF164DFT36R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 36 OHM 1206

5000
RAVF104DJT130K

RAVF104DJT130K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 130K OHM 0804

0
RAVF168DZT0R00

RAVF168DZT0R00

Stackpole Electronics, Inc.

RES ARRAY 8 RES ZERO OHM 1506

0
RAVF104DFT4K30

RAVF104DFT4K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.3K OHM 0804

0
RAVF104DFT240K

RAVF104DFT240K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 240K OHM 0804

0
RAVF164DJT13R0

RAVF164DJT13R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 13 OHM 1206

0
RAVF168DFT47R0

RAVF168DFT47R0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 47 OHM 1506

0
RAVF164DJT18R0

RAVF164DJT18R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 18 OHM 1206

0
RAVF164DFT39R0

RAVF164DFT39R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 39 OHM 1206

0
RAVF104DJT910K

RAVF104DJT910K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 910K OHM 0804

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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