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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF164DFT43R0

RAVF164DFT43R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 43 OHM 1206

0
RAVF164DJT1K10

RAVF164DJT1K10

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.1K OHM 1206

0
RAVF164DJT6R20

RAVF164DJT6R20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 6.2 OHM 1206

0
RAVF104DJT510R

RAVF104DJT510R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 510 OHM 0804

0
RAVF102DJT3K00

RAVF102DJT3K00

Stackpole Electronics, Inc.

RES ARRAY 2 RES 3K OHM 0404

0
RAVF104DJT4R30

RAVF104DJT4R30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.3 OHM 0804

0
RAVF164DJT200K

RAVF164DJT200K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 200K OHM 1206

0
RAVF164DFT121R

RAVF164DFT121R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 121 OHM 1206

0
RAVF104DFT820K

RAVF104DFT820K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 820K OHM 0804

0
RAVF104DFT11K0

RAVF104DFT11K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 11K OHM 0804

0
RAVF162DJT270R

RAVF162DJT270R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 270 OHM 0606

0
RAVF164DJT760K

RAVF164DJT760K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 760K OHM 1206

0
RAVF104DJT680R

RAVF104DJT680R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 680 OHM 0804

0
RAVF164DJT1K00

RAVF164DJT1K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1K OHM 1206

10259
RAVF164DJT22R0

RAVF164DJT22R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 22 OHM 1206

20000
RAVF168DJT270R

RAVF168DJT270R

Stackpole Electronics, Inc.

RES ARRAY 8 RES 270 OHM 1506

0
RAVF104DFT5K60

RAVF104DFT5K60

Stackpole Electronics, Inc.

RES ARRAY 4 RES 5.6K OHM 0804

0
RAVF164DFT43K0

RAVF164DFT43K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 43K OHM 1206

0
RAVF104DJT10K0

RAVF104DJT10K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10K OHM 0804

24
RAVF104DJT270K

RAVF104DJT270K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 270K OHM 0804

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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