Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CS33-10KG1MD0016 Vishay / Sfernice	RES THIN FILM NETWORKS	0
4606X-101-473LF J.W. Miller / Bourns	RES ARRAY 5 RES 47K OHM 6SIP	0
YC324-FK-071K62L Yageo	RES ARRAY 4 RES 1.62K OHM 2012	0
4116R-1-472 J.W. Miller / Bourns	RES ARRAY 8 RES 4.7K OHM 16DIP	2332
4820P-3-331/680 J.W. Miller / Bourns	RES NTWRK 36 RES MULT OHM 20SOIC	0
TC124-FR-0756K2L Yageo	RES ARRAY 4 RES 56.2K OHM 0804	0
CN22F22R1CT CAL-CHIP ELECTRONICS INC.	RESARRAY0402X2 1% 22.1 OHM	890000
CN34J114CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 110K OHM	0
Y1685V0004TT9W VPG Foil	RES NETWORK 2 RES 1K OHM 1505	0
NOMCT16035001FT1 Vishay	RES ARRAY 8 RES 5K OHM 16SOIC	0
YC248-FR-0743RL Yageo	RES ARRAY 8 RES 43 OHM 1606	0
TC164-FR-07475KL Yageo	RES ARRAY 4 RES 475K OHM 1206	0
ORNTV20015001TS Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
YC248-JR-071K1L Yageo	RES ARRAY 8 RES 1.1K OHM 1606	0
4306R-101-500 J.W. Miller / Bourns	RES ARRAY 5 RES 50 OHM 6SIP	0
VSSR1603390GTF Vishay	RES ARRAY 8 RES 39 OHM 16SSOP	0
TC164-FR-07113RL Yageo	RES ARRAY 4 RES 113 OHM 1206	0
EXB-E10C273J Panasonic	RES ARRAY 8 RES 27K OHM 1608	45435
AF164-FR-077K32L Yageo	RES ARRAY 4 RES 7.32K OHM 1206	0
767141330GPTR13 CTS Corporation	RES ARRAY 13 RES 33 OHM 14SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages