Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-2HV1R0JV Panasonic	RES ARRAY 8 RES 1 OHM 1506	2990
4116R-2-105LF J.W. Miller / Bourns	RES ARRAY 15 RES 1M OHM 16DIP	0
YC324-FK-07680KL Yageo	RES ARRAY 4 RES 680K OHM 2012	0
TC164-FR-07105RL Yageo	RES ARRAY 4 RES 105 OHM 1206	0
Y4485V0246QT9W VPG Foil	RES NETWORK 2 RES MULT OHM 1610	0
Y1747V0190QQ9W VPG Foil	RES ARRAY 4 RES MULT OHM 8SOIC	0
ORNTV25025001TF Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
AF164-FR-0742R2L Yageo	RES ARRAY 4 RES 42.2 OHM 1206	0
CAT16-240J4GLF J.W. Miller / Bourns	RES ARRAY 4 RES 24 OHM 1206	0
RP102PJ470CS Samsung Electro-Mechanics	RES ARRAY 2 RES 47 OHM 0404	3800
766163222GP CTS Corporation	RES ARRAY 8 RES 2.2K OHM 16SOIC	426
4308R-101-471LF J.W. Miller / Bourns	RES ARRAY 7 RES 470 OHM 8SIP	0
TC124-FR-07511KL Yageo	RES ARRAY 4 RES 511K OHM 0804	0
RAVF162DJT3K00 Stackpole Electronics, Inc.	RES ARRAY 2 RES 3K OHM 0606	0
4816P-T02-223 J.W. Miller / Bourns	RES ARRAY 15 RES 22K OHM 16SOIC	0
YC162-FR-072K55L Yageo	RES ARRAY 2 RES 2.55K OHM 0606	0
YC122-FR-0724R9L Yageo	RES ARRAY 2 RES 24.9 OHM 0404	0
YC248-FR-0716K9L Yageo	RES ARRAY 8 RES 16.9K OHM 1606	0
Y4485V0091BQ9W VPG Foil	RES NETWORK 2 RES 500 OHM 1610	0
RAVF168DJT33R0 Stackpole Electronics, Inc.	RES ARRAY 8 RES 33 OHM 1506	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages