Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
RAVF104DFT270K Stackpole Electronics, Inc.	RES ARRAY 4 RES 270K OHM 0804	0
4609X-101-221LF J.W. Miller / Bourns	RES ARRAY 8 RES 220 OHM 9SIP	3076
768163204GP CTS Corporation	RES ARRAY 8 RES 200K OHM 16SOIC	0
YC162-FR-0743RL Yageo	RES ARRAY 2 RES 43 OHM 0606	0
MNR14ERAPJ822 ROHM Semiconductor	RES ARRAY 4 RES 8.2K OHM 1206	2468
AF164-FR-07191RL Yageo	RES ARRAY 4 RES 191 OHM 1206	0
4814P-T01-330LF J.W. Miller / Bourns	RES ARRAY 7 RES 33 OHM 14SOIC	0
ORNTV20012001UF Vishay	RES NETWORK 5 RES 2K OHM 8SOIC	0
4610X-101-184LF J.W. Miller / Bourns	RES ARRAY 9 RES 180K OHM 10SIP	0
Y1747V0191AQ9U VPG Foil	RES ARRAY 4 RES 1K OHM 8SOIC	0
M8340108K1002GCD03 Vishay / Dale	RES ARRAY 7 RES 10K OHM 8SIP	0
YC122-FR-0747RL Yageo	RES ARRAY 2 RES 47 OHM 0404	0
RAVF104DJT3R90 Stackpole Electronics, Inc.	RES ARRAY 4 RES 3.9 OHM 0804	0
YC248-FR-0761K9L Yageo	RES ARRAY 8 RES 61.9K OHM 1606	0
EXB-38V242JV Panasonic	RES ARRAY 4 RES 2.4K OHM 1206	0
741X16349R9FP CTS Corporation	RES ARRAY 49.9 OHM 8 RES 1506	0
TC164-FR-07536RL Yageo	RES ARRAY 4 RES 536 OHM 1206	0
CRA06S0836K80JTA Vishay / Dale	RES ARRAY 4 RES 6.8K OHM 1206	365
742C043332JP CTS Corporation	RES ARRAY 2 RES 3.3K OHM 0606	0
CSC06A016K80GPA Vishay / Dale	RES ARRAY 5 RES 6.8K OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages