Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-2HV121JV Panasonic	RES ARRAY 8 RES 120 OHM 1506	7
CAY16-470J2LF J.W. Miller / Bourns	RES ARRAY 2 RES 47 OHM 0606	0
YC162-FR-07619KL Yageo	RES ARRAY 2 RES 619K OHM 0606	0
RM064PJ474CS Samsung Electro-Mechanics	RESISTOR ARRAY INVERTED 0201X4	0
ORNV10022502T5 Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
YC324-FK-07113KL Yageo	RES ARRAY 4 RES 113K OHM 2012	0
741X083330GP CTS Corporation	RES ARRAY 4 RES 33 OHM 0804	0
TC164-FR-0747RL Yageo	RES ARRAY 4 RES 47 OHM 1206	3307
HVD5-B10M-050-05 Caddock Electronics, Inc.	RES NETWORK 2 RES MULT OHM 15SIP	365
766163151GPTR13 CTS Corporation	RES ARRAY 8 RES 150 OHM 16SOIC	0
4816P-T01-105 J.W. Miller / Bourns	RES ARRAY 8 RES 1M OHM 16SOIC	0
YC248-FR-0760K4L Yageo	RES ARRAY 8 RES 60.4K OHM 1606	0
RM064PJ270CS Samsung Electro-Mechanics	RESISTOR ARRAY INVERTED 0201X4	0
EXB-N8V361JX Panasonic	RES ARRAY 4 RES 360 OHM 0804	5334
4814P-2-181 J.W. Miller / Bourns	RES ARRAY 13 RES 180 OHM 14SOIC	0
PRA100I4-100RBBBT Vishay / Sfernice	SFERNICE THIN FILMS	0
4814P-T01-680 J.W. Miller / Bourns	RES ARRAY 7 RES 68 OHM 14SOIC	0
YC164-JR-07430RL Yageo	RES ARRAY 4 RES 430 OHM 1206	0
4606X-102-152LF J.W. Miller / Bourns	RES ARRAY 3 RES 1.5K OHM 6SIP	927
TC124-FR-07562RL Yageo	RES ARRAY 4 RES 562 OHM 0804	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages