Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
768161151GPTR13 CTS Corporation	RES ARRAY 15 RES 150 OHM 16SOIC	0
CAT16-1603F4LF J.W. Miller / Bourns	RES ARRAY 4 RES 160K OHM 1206	0
YC248-FR-07255KL Yageo	RES ARRAY 8 RES 255K OHM 1606	0
EXB-24V224JX Panasonic	RES ARRAY 2 RES 220K OHM 0404	14440
741C083201JP CTS Corporation	RES ARRAY 4 RES 200 OHM 0804	0
4820P-1-270 J.W. Miller / Bourns	RES ARRAY 10 RES 27 OHM 20SOIC	0
EXB-24V470JX Panasonic	RES ARRAY 2 RES 47 OHM 0404	9897
Y4485V0001AT0R VPG Foil	RES NETWORK 2 RES 10K OHM 1610	0
EXB-Q16P151J Panasonic	RES ARRAY 15 RES 150 OHM 1506	0
4816P-T02-471LF J.W. Miller / Bourns	RES ARRAY 15 RES 470 OHM 16SOIC	394
AF164-FR-07887RL Yageo	RES ARRAY 4 RES 887 OHM 1206	0
YC162-FR-0719K6L Yageo	RES ARRAY 2 RES 19.6K OHM 0606	0
767161202GPTR13 CTS Corporation	RES ARRAY 15 RES 2K OHM 16SOIC	0
YC324-FK-0738K3L Yageo	RES ARRAY 4 RES 38.3K OHM 2012	0
EXB-V4V331JV Panasonic	RES ARRAY 2 RES 330 OHM 0606	11521
77063102P CTS Corporation	RES ARRAY 3 RES 1K OHM 6SIP	437
CSC07A0147K0GPA Vishay / Dale	RES ARRAY 6 RES 47K OHM 7SIP	0
4818P-T02-121LF J.W. Miller / Bourns	RES ARRAY 17 RES 120 OHM 18SOIC	0
RP104PJ390CS Samsung Electro-Mechanics	RES ARRAY 4 RES 39 OHM 0804	22
766161820GPTR7 CTS Corporation	RES ARRAY 15 RES 82 OHM 16SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages