Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
768163224GP CTS Corporation	RES ARRAY 8 RES 220K OHM 16SOIC	0
AF164-FR-07187RL Yageo	RES ARRAY 4 RES 187 OHM 1206	0
742C083473GP CTS Corporation	RES ARRAY 4 RES 47K OHM 1206	0
YC162-FR-07226KL Yageo	RES ARRAY 2 RES 226K OHM 0606	0
YC122-FR-07102RL Yageo	RES ARRAY 2 RES 102 OHM 0404	0
ACASA1002S1002P100 Vishay / Beyschlag	RES ARRAY 4 RES 10K OHM 1206	1213
4308R-101-223LF J.W. Miller / Bourns	RES ARRAY 7 RES 22K OHM 8SIP	163
CNP34D2201CT-50 CAL-CHIP ELECTRONICS INC.	TFA 0603X4 .5% 2.2K OHM 50P	35000
CAT16-123J4LF J.W. Miller / Bourns	RES ARRAY 4 RES 12K OHM 1206	0
YC164-FR-07196RL Yageo	RES ARRAY 4 RES 196 OHM 1206	0
77063470P CTS Corporation	RES ARRAY 3 RES 47 OHM 6SIP	0
742X083680JP CTS Corporation	RES ARRAY 4 RES 68 OHM 1206	0
AF164-FR-07562RL Yageo	RES ARRAY 4 RES 562 OHM 1206	0
CAT16-124J4LF J.W. Miller / Bourns	RES ARRAY 4 RES 120K OHM 1206	0
767163393GP CTS Corporation	RES ARRAY 8 RES 39K OHM 16SOIC	0
YC162-FR-072K4L Yageo	RES ARRAY 2 RES 2.4K OHM 0606	0
AF164-FR-07200KL Yageo	RES ARRAY 4 RES 200K OHM 1206	0
YC324-FK-0763R4L Yageo	RES ARRAY 4 RES 63.4 OHM 2012	0
RAVF104DJT16R0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 16 OHM 0804	0
CN34J511CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 5% 510 OHM	320000

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages