Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
4310M-101-103LF J.W. Miller / Bourns	RES ARRAY 9 RES 10K OHM 10SIP	1666
4116R-1-305LF J.W. Miller / Bourns	RES ARRAY 8 RES 3M OHM 16DIP	0
RAVF164DJT240R Stackpole Electronics, Inc.	RES ARRAY 4 RES 240 OHM 1206	0
MPMT10012502BT1 Vishay	RES NTWRK 2 RES MULT OHM TO236-3	0
767141273GPTR13 CTS Corporation	RES ARRAY 13 RES 27K OHM 14SOIC	0
YC162-FR-0739R2L Yageo	RES ARRAY 2 RES 39.2 OHM 0606	0
MSP06A05131AGEJ Vishay / Dale	RES NETWORK 8 RES MULT OHM 6SIP	0
4816P-1-501LF J.W. Miller / Bourns	RES ARRAY 8 RES 500 OHM 16SOIC	0
YC248-JR-0715RL Yageo	RES ARRAY 8 RES 15 OHM 1606	0
EXB-A10P273J Panasonic	RES ARRAY 8 RES 27K OHM 2512	4000
TC124-FR-0712K7L Yageo	RES ARRAY 4 RES 12.7K OHM 0804	0
RF062PJ102CS Samsung Electro-Mechanics	RESISTOR ARRAY FLAT TERMINAL 0	0
4310M-101-512LF J.W. Miller / Bourns	RES ARRAY 9 RES 5.1K OHM 10SIP	0
742C043120JP CTS Corporation	RES ARRAY 2 RES 12 OHM 0606	0
YC324-FK-07453KL Yageo	RES ARRAY 4 RES 453K OHM 2012	0
MORNTA1002AT5 Vishay	RES ARRAY 4 RES 10K OHM 8TSSOP	705
4814P-2-513 J.W. Miller / Bourns	RES ARRAY 13 RES 51K OHM 14SOIC	0
4816P-2-272LF J.W. Miller / Bourns	RES ARRAY 15 RES 2.7K OHM 16SOIC	0
CAT16-103J4GLF J.W. Miller / Bourns	RES ARRAY 4 RES 10K OHM 1206	0
VSSR2401391JUF Vishay	RES ARRAY 23 RES 390 OHM 24SSOP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages