Solderless Breadboards

Part Number	Description / PDF	Quantity
LS-00017 OSEPP Electronics	BREADBOARD SELF ADHERING 2PK	258
PB-83E Global Specialties	EXT PWRD BREADBOARD 830 TIE-PNT	26
FIT0096-C DFRobot	BREADBRD TERM STRIP 3.23X2.44"	57
319030005 Seeed	MINI BREAD BOARD 4.5X3.5CM-BLUE	33
700-00078 Parallax, Inc.	BREADBOARD TERM STRIP 6.88X2.56"	82
351 Pololu Corporation	400-POINT BREADBOARD	614
240-131 Digilent, Inc.	BREADBOARD TERM STRIP 3.29X2.15"	68
PB-204 Global Specialties	POWERED BREADBOARD	16
922309 3M	BREADBOARD ASSEMBLY 7.00X4.00"	84
OB1-LF Twin Industries	BREADBOARD DISTI STRIP 4X4"	19
BB630 BusBoard Prototype Systems	630 TIE-POINT SOLDERLESS PLUG-IN	19
LS-00018 OSEPP Electronics	BREADBOARD - 400 TIE POINTS	375
FIT0096 DFRobot	BREADBRD TERM STRIP 3.20X2.00"	2615
OB2-LF Twin Industries	BREADBOARD DISTI STRIP 3.47X3.4"	61
922318 3M	BREADBOARD ASSEMBLY 7.75X6.25"	37
BB-32623 Bud Industries, Inc.	BREADBOARD TIE-POINT 4560	1844
923281-I 3M	BREADBOARD DISTI BUS 4.90X0.35"	0
PB-5 Global Specialties	BREADBOARD RPLC FOR PB-507	0
TW-E40-510 Twin Industries	BREADBOARD TERM STRIP 3.30X2.14"	87
GS-351 Global Specialties	BREADBRD TERM STRIP 4.00X1.38"	74

Solderless Breadboards

1. Overview

Solderless breadboards are reusable electronic prototyping tools that enable rapid circuit assembly without requiring soldering. They utilize spring-loaded contacts to temporarily connect components, offering a cost-effective platform for testing and development. These boards are essential in modern electronics engineering, education, and DIY projects due to their flexibility, reusability, and ease of use.

2. Major Types & Functional Classification

Type	Functional Characteristics	Application Examples
Half-Size Breadboard	400-600 tie points, single power rail	Basic electronics education, small-scale prototyping
Full-Size Breadboard	800+ tie points, dual power rails	Complex circuit development, embedded system testing
Mini Breadboard	170-300 tie points, compact design	Portable projects, sensor integration
Modular Breadboard	Connectable units with bus expansion	Scalable IoT device prototyping
Stackable Breadboard	Vertical expansion capability	Multilayer system development

3. Structure & Composition

Typical construction features:

ABS plastic base with 0.1" grid spacing
Phosphor bronze contacts with gold plating
Embedded bus strips (typically 2x5 rows)
Component retention springs (28-32 AWG compatibility)
Polarized power distribution rails
Anti-static surface treatment

4. Key Technical Specifications

Parameter	Typical Value	Significance
Contact Resistance	<1	Ensures signal integrity
Current Capacity	1-5A per node	Determines power handling
Voltage Range	0-30V DC	Defines operational safety
Insertion Force	50-150gF	Affects component durability
Terminal Durability	10,000+ insertions	Dictates product lifespan
Temperature Range	-20 C to +70 C	Environmental stability

5. Application Domains

Primary industries and typical equipment:

Education: Student lab kits, STEM training platforms
Industrial R&D: Sensor network prototyping, control system development
Consumer Electronics: Wearable device testing, IoT gateway development
Robotics: Motor driver testing, sensor fusion prototyping
Research: Analog/digital circuit validation, failure analysis

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
Elegoo	EL-140088	830-point full-size board with dual power rails
SparkFun	DEV-12002	Stackable design with 630 tie points
Fritzing	MB102-01	Surface-mount compatible bus system
Bud Industries	431 Series	Industrial-grade contacts with EMI shielding

7. Selection Recommendations

Key considerations:

Project complexity vs. node count requirement
Power distribution needs (single/dual rails)
Component compatibility (through-hole/SMD)
Environmental factors (temperature/humidity)
Expansion requirements (modular connectivity)
Budget constraints vs. durability specifications

8. Industry Trends Analysis

Current development directions include:

Miniaturization with high-density interconnects
Integration of built-in measurement circuits
Smart breadboards with IoT connectivity
Eco-friendly materials with RoHS compliance
Improved contact systems for high-frequency applications
Standardization of modular expansion interfaces

Market growth driven by increasing demand in educational robotics, rapid prototyping services, and decentralized development environments.