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Solderless Breadboards

Image Part Number Description / PDF Quantity Rfq
EXP-300E

EXP-300E

Global Specialties

BREADBRD TERM STRIP 6.50X1.75"

23
923297-I

923297-I

3M

BREADBRD TRM STRP 0.63X0.2" 20PC

0
319030006

319030006

Seeed

MINI BREAD BOARD 4.5X3.5CM-GREEN

223
PRT-12046

PRT-12046

SparkFun

BREADBOARD TERM STRIP 1.85X1.38"

0
922327

922327

3M

BREADBOARD ASSEMBLY 8.00X9.25"

0
PRT-12044

PRT-12044

SparkFun

BREADBOARD TERM STRIP 1.85X1.38"

0
MIKROE-1138

MIKROE-1138

MikroElektronika

BREADBOARD TERMINAL STRIP

3
GS-100T

GS-100T

Global Specialties

BREADBRD DISTI STRIP 6.50X0.69"

16
340-002-1

340-002-1

Digilent, Inc.

BREADBOARD KIT SOLDERLESS LARGE

424
923749-I

923749-I

3M

BREADBOARD TERM STRIP 4.90X2.25"

0
2463

2463

Adafruit

MINI SOLDERLESS BREADBOARD 4X4

0
TW-E41-T2

TW-E41-T2

Twin Industries

BREADBOARD ASSEMBLY 6.90X5.70"

5
923299-I

923299-I

3M

BREADBOARD TERMINAL STRIP 20PC

0
920-0137-01

920-0137-01

SchmartBoard

BREADBOARD 400 TEST POINTS

62
353

353

Pololu Corporation

1660-POINT BREADBOARD

56
FIT0008

FIT0008

DFRobot

BREADBOARD TERM STRIP 1.80X1.40"

30
319030004

319030004

Seeed

BREADBRD TERM STRIP 1.77X1.38"

9
BB-32622

BB-32622

Bud Industries, Inc.

BREADBOARD TIE-POINT 2800

85
TW-E41-T1

TW-E41-T1

Twin Industries

BREADBOARD ASSEMBLY 6.50X2.20"

41
MIKROE-1139

MIKROE-1139

MikroElektronika

BREADBOARD MINI SELF-ADHESIVE WH

32

Solderless Breadboards

1. Overview

Solderless breadboards are reusable electronic prototyping tools that enable rapid circuit assembly without requiring soldering. They utilize spring-loaded contacts to temporarily connect components, offering a cost-effective platform for testing and development. These boards are essential in modern electronics engineering, education, and DIY projects due to their flexibility, reusability, and ease of use.

2. Major Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
Half-Size Breadboard400-600 tie points, single power railBasic electronics education, small-scale prototyping
Full-Size Breadboard800+ tie points, dual power railsComplex circuit development, embedded system testing
Mini Breadboard170-300 tie points, compact designPortable projects, sensor integration
Modular BreadboardConnectable units with bus expansionScalable IoT device prototyping
Stackable BreadboardVertical expansion capabilityMultilayer system development

3. Structure & Composition

Typical construction features:

  • ABS plastic base with 0.1" grid spacing
  • Phosphor bronze contacts with gold plating
  • Embedded bus strips (typically 2x5 rows)
  • Component retention springs (28-32 AWG compatibility)
  • Polarized power distribution rails
  • Anti-static surface treatment

4. Key Technical Specifications

ParameterTypical ValueSignificance
Contact Resistance<1 Ensures signal integrity
Current Capacity1-5A per nodeDetermines power handling
Voltage Range0-30V DCDefines operational safety
Insertion Force50-150gFAffects component durability
Terminal Durability10,000+ insertionsDictates product lifespan
Temperature Range-20 C to +70 CEnvironmental stability

5. Application Domains

Primary industries and typical equipment:

  • Education: Student lab kits, STEM training platforms
  • Industrial R&D: Sensor network prototyping, control system development
  • Consumer Electronics: Wearable device testing, IoT gateway development
  • Robotics: Motor driver testing, sensor fusion prototyping
  • Research: Analog/digital circuit validation, failure analysis

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
ElegooEL-140088830-point full-size board with dual power rails
SparkFunDEV-12002Stackable design with 630 tie points
FritzingMB102-01Surface-mount compatible bus system
Bud Industries431 SeriesIndustrial-grade contacts with EMI shielding

7. Selection Recommendations

Key considerations:

  • Project complexity vs. node count requirement
  • Power distribution needs (single/dual rails)
  • Component compatibility (through-hole/SMD)
  • Environmental factors (temperature/humidity)
  • Expansion requirements (modular connectivity)
  • Budget constraints vs. durability specifications

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization with high-density interconnects
  • Integration of built-in measurement circuits
  • Smart breadboards with IoT connectivity
  • Eco-friendly materials with RoHS compliance
  • Improved contact systems for high-frequency applications
  • Standardization of modular expansion interfaces

Market growth driven by increasing demand in educational robotics, rapid prototyping services, and decentralized development environments.

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