Solderless Breadboards

Part Number	Description / PDF	Quantity
GS-630 Global Specialties	BREADBRD TERM STRIP 6.50X1.38"	104
65 Adafruit	BREADBOARD TERM STRIP 1.80X1.40"	80
1491 Pololu Corporation	170-POINT BREADBOARD (RED)	80
923292-I 3M	BREADBOARD TERM STRIP 6.50X0.63"	5
GS-830T Global Specialties	BREADBRD TERM STRIP 6.50X2.13"	45
TW-E41-102B Twin Industries	BREADBOARD ASSEM 6.5X2.14" 70PC	168
PB-101M Global Specialties	BREADBOARD ASSEMBLY 8.46X3.94"	5
922336 3M	BREADBRD ASSEMBLY 10.25X9.25"	18
BB-32650-R Bud Industries, Inc.	BREADBRD DBL STRIP 70TIE-PTS RED	37231
352 Pololu Corporation	830-POINT BREADBOARD	801
923273-I 3M	BREADBOARD TERM STRIP 1.80X1.36"	7
GS-630T Global Specialties	BREADBRD TERM STRIP 6.50X1.38"	0
FIT0009 DFRobot	BREADBOARD TERM STRIP 6.70X2.60"	0
GS-470 Global Specialties	BREADBRD TERM STRIP 5.25X1.38"	39
340-015-1 Digilent, Inc.	SOLDERLESS BREADBOARD KIT: SMALL	1
OB3-LF Twin Industries	BREADBOARD DISTI STRIP 6.70X3"	61
471-032 Digilent, Inc.	BLANK CANVAS WITH TWO SOLDERLESS	4
BB-32619 Bud Industries, Inc.	BREADBOARD ASSEMBLY 6.50X5.31"	1468
9433 TubeDepot	ELENCO 1660 TIE POINT BREADBOARD	5
PB-105M Global Specialties	BREADBOARD ASSEMBLY 12.01X9.45"	16

Solderless Breadboards

1. Overview

Solderless breadboards are reusable electronic prototyping tools that enable rapid circuit assembly without requiring soldering. They utilize spring-loaded contacts to temporarily connect components, offering a cost-effective platform for testing and development. These boards are essential in modern electronics engineering, education, and DIY projects due to their flexibility, reusability, and ease of use.

2. Major Types & Functional Classification

Type	Functional Characteristics	Application Examples
Half-Size Breadboard	400-600 tie points, single power rail	Basic electronics education, small-scale prototyping
Full-Size Breadboard	800+ tie points, dual power rails	Complex circuit development, embedded system testing
Mini Breadboard	170-300 tie points, compact design	Portable projects, sensor integration
Modular Breadboard	Connectable units with bus expansion	Scalable IoT device prototyping
Stackable Breadboard	Vertical expansion capability	Multilayer system development

3. Structure & Composition

Typical construction features:

ABS plastic base with 0.1" grid spacing
Phosphor bronze contacts with gold plating
Embedded bus strips (typically 2x5 rows)
Component retention springs (28-32 AWG compatibility)
Polarized power distribution rails
Anti-static surface treatment

4. Key Technical Specifications

Parameter	Typical Value	Significance
Contact Resistance	<1	Ensures signal integrity
Current Capacity	1-5A per node	Determines power handling
Voltage Range	0-30V DC	Defines operational safety
Insertion Force	50-150gF	Affects component durability
Terminal Durability	10,000+ insertions	Dictates product lifespan
Temperature Range	-20 C to +70 C	Environmental stability

5. Application Domains

Primary industries and typical equipment:

Education: Student lab kits, STEM training platforms
Industrial R&D: Sensor network prototyping, control system development
Consumer Electronics: Wearable device testing, IoT gateway development
Robotics: Motor driver testing, sensor fusion prototyping
Research: Analog/digital circuit validation, failure analysis

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
Elegoo	EL-140088	830-point full-size board with dual power rails
SparkFun	DEV-12002	Stackable design with 630 tie points
Fritzing	MB102-01	Surface-mount compatible bus system
Bud Industries	431 Series	Industrial-grade contacts with EMI shielding

7. Selection Recommendations

Key considerations:

Project complexity vs. node count requirement
Power distribution needs (single/dual rails)
Component compatibility (through-hole/SMD)
Environmental factors (temperature/humidity)
Expansion requirements (modular connectivity)
Budget constraints vs. durability specifications

8. Industry Trends Analysis

Current development directions include:

Miniaturization with high-density interconnects
Integration of built-in measurement circuits
Smart breadboards with IoT connectivity
Eco-friendly materials with RoHS compliance
Improved contact systems for high-frequency applications
Standardization of modular expansion interfaces

Market growth driven by increasing demand in educational robotics, rapid prototyping services, and decentralized development environments.