PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4231CMS-2#TRPBF

LTC4231CMS-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

0

ISL61861BIBZ-T

ISL61861BIBZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

TPS2393APWR

TPS2393APWR

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

0

ISL61853PCRZ-T

ISL61853PCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC4251BIS6#TRMPBF

LTC4251BIS6#TRMPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V TSOT23-6

103

TPS2341PHP

TPS2341PHP

Texas Instruments

POWER SUPPLY CIRCUIT, FIXED

765

LTC4225IUFD-1#TRPBF

LTC4225IUFD-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

0

LTC4252A-2IMS#TRPBF

LTC4252A-2IMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

LTC4221CGN#TRPBF

LTC4221CGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

0

TPS24750RUVT

TPS24750RUVT

Texas Instruments

IC HOT SWAP CTRLR GP 36VQFN

392

MAX5939EESA+

MAX5939EESA+

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

1500

MIC2342R-2YTQ

MIC2342R-2YTQ

Roving Networks / Microchip Technology

IC HOT PLUG CTRLR PCI EXP 48TQFP

0

LTC4225CGN-2#PBF

LTC4225CGN-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

30

LTC4225IGN-1#TRPBF

LTC4225IGN-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

0

ISL61862ACRZ

ISL61862ACRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

LTC4231HMS-2#WPBF

LTC4231HMS-2#WPBF

Analog Devices, Inc.

UP HOT SWAP CNTR

67

ISL61853BCRZ-T

ISL61853BCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

UCC2917D

UCC2917D

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

3875

MAX5939FESA+

MAX5939FESA+

Analog Devices, Inc.

HOT-SWAP CONTROLLERS

1704

UCC3913D

UCC3913D

UCC3913 NEGATIVE FLOATING SINGLE

17997

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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