PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4242IG#TRPBF

LTC4242IG#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI EXP 36SSOP

0

ADM1176-1ARMZ-R7

ADM1176-1ARMZ-R7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

0

TPS24772RGET

TPS24772RGET

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

34

LTC1645CS8#PBF

LTC1645CS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

103

ISL61863ACRZ-T

ISL61863ACRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

TPS25910RSAR

TPS25910RSAR

Texas Instruments

IC HOT SWAP CTRLR GP 16QFN

8468

TPS2343DDP

TPS2343DDP

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

29504

LTC4235IUFD-2#PBF

LTC4235IUFD-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

1

LT4250LCS8#TRPBF

LT4250LCS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

0

TPS24742RGET

TPS24742RGET

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

404

MIC2584-JYTS-TR

MIC2584-JYTS-TR

Roving Networks / Microchip Technology

IC HOT SWAP CTRLR GP 16TSSOP

0

LT1641-1IS8#TRPBF

LT1641-1IS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

3082

LTC4282CUH#PBF

LTC4282CUH#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 32QFN

1

MIC2341-2YTQ

MIC2341-2YTQ

Roving Networks / Microchip Technology

PCI EXPRESS HOT-PLUG CONTROLLER

301

HPC3130APBM

HPC3130APBM

Texas Instruments

PCI BUS CONTROLLER, CMOS

3033

LTC4228IGN-1#PBF

LTC4228IGN-1#PBF

Analog Devices, Inc.

DUAL IDEAL DIODE AND HOT SWAP CO

371

UCC2913D

UCC2913D

UCC2913 NEGATIVE FLOATING SINGLE

43914

MAX15091ETI+T

MAX15091ETI+T

Maxim Integrated

IC HOT SWAP CTRLR GP 28TQFN

2500

LTC4238CGN#PBF

LTC4238CGN#PBF

Analog Devices, Inc.

HIGHVOLTAGE, HIGHPOWER HOTSWAP C

0

ISL61863IIRZ-T

ISL61863IIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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