PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS23521PWR

TPS23521PWR

Texas Instruments

IC HOT SWAP CTRLR -48V 16TSSOP

0

ADM1276-3ACPZ-RL

ADM1276-3ACPZ-RL

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20LFCSP

3084

UCC2919PW

UCC2919PW

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

65970

LTC4231CUD-1#PBF

LTC4231CUD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12QFN

598

MAX5937AAESA

MAX5937AAESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

539

LM5067MM-2

LM5067MM-2

POWER SUPPLY SUPPORT CIRCUIT, AD

11000

LTC1646CGN#TRPBF

LTC1646CGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

0

MAX5925CEUB+

MAX5925CEUB+

Analog Devices, Inc.

MAX5925 1V TO 13.2V, N-CHANNEL H

73

ISL61851BCBZ-T

ISL61851BCBZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

MAX8533EUB

MAX8533EUB

Analog Devices, Inc.

INFINIBAND HOT-SWAP CONTROLLER

817

LTC4218CDHC-12#PBF

LTC4218CDHC-12#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16DFN

912

LTC4223IDHD-2#TRPBF

LTC4223IDHD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16DFN

0

LT1641CS8#TRPBF

LT1641CS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

0

LTC1422IN8#PBF

LTC1422IN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8DIP

0

UCC2912N

UCC2912N

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

6475

LTC4215IUFD-2#PBF

LTC4215IUFD-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

0

LTC1421ISW-2.5#PBF

LTC1421ISW-2.5#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SOIC

0

ISL61853MIRZ-T

ISL61853MIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

UC2914DWTR

UC2914DWTR

Texas Instruments

UC2914 5-35V SINGLE, HOT-SWAP IC

4000

ADM1070ART-REEL7

ADM1070ART-REEL7

Analog Devices, Inc.

-48 V HOT SWAP CONTROLLER

26765

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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