Memory - Configuration Proms for FPGAs

Image Part Number Description / PDF Quantity Rfq
XCF08PVO48C

XCF08PVO48C

Xilinx

CONFIG MEMORY, 8MX1, SERIAL

25973

XCF08PVO48C.

XCF08PVO48C.

Xilinx

CONFIG MEMORY, 8MX1, SERIAL

305

AT17LV002-10SU

AT17LV002-10SU

Roving Networks / Microchip Technology

IC EEPROM SRL CONFG 2M LV 20SOIC

85

EPCQ16ASI8N

EPCQ16ASI8N

Intel

IC CONFIG DEVICE 16MBIT 8SOIC

7152

XC17128ELVO8C

XC17128ELVO8C

Xilinx

CONFIG MEMORY, 128KX1, SERIAL

51

XC17V02PC20I

XC17V02PC20I

Xilinx

CONFIG MEMORY, 2MX1, SERIAL

313

AT17LV256-10SU

AT17LV256-10SU

Roving Networks / Microchip Technology

IC SRL CONFG EEPROM 256K 20SOIC

133

XC18V512PC20C

XC18V512PC20C

Xilinx

IC PROM SRL CONFIG 512K 20-PLCC

0

XC1701PC20C

XC1701PC20C

Xilinx

CONFIG MEMORY, 1MX1, SERIAL

41

AT17LV128-10NC

AT17LV128-10NC

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

2529

XC18V04PC44C

XC18V04PC44C

Xilinx

IC PROM SER C-TEMP 3.3V 44-PLCC

0

AT17LV512-10CC

AT17LV512-10CC

Roving Networks / Microchip Technology

IC SRL CONFG EEPROM 512K LV 8LAP

25

SST27SF010-70-3C-PHE

SST27SF010-70-3C-PHE

CUSTOM FLASH MEMORY

0

AT17N512-10PI

AT17N512-10PI

Atmel (Microchip Technology)

CONFIG MEMORY, 512KX1, SERIAL

395

AT17F16-30CU

AT17F16-30CU

Roving Networks / Microchip Technology

AT17F16 - CONFIGURATION MEMORY,

90

AT18F010-30XU

AT18F010-30XU

Roving Networks / Microchip Technology

IC FLASH CONFIG 1MBIT 20-TSSOP

237

AT17LV128-10CI

AT17LV128-10CI

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 128K 8-LAP

142

AT17LV002-10JC

AT17LV002-10JC

Atmel (Microchip Technology)

CONFIG MEMORY, 2MX1, SERIAL

321

XCF08PFSG48C

XCF08PFSG48C

Xilinx

IC PROM SRL 1.8V 8M GATE 48CSBGA

4

XC17256EPC20I

XC17256EPC20I

Xilinx

CONFIG MEMORY, 256KX1, SERIAL

1958

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
OTP PROMsOne-Time Programmable, low cost, high reliabilityIndustrial control systems
Flash PROMsReprogrammable, high density, moderate endurance5G base stations
EEPROMByte-alterable, high endurance, slower access speedMedical imaging equipment
FRAMLow-power, radiation-hardened, fast write speedAerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

  • Package types: TSSOP, VQFN, BGA
  • Memory array: Floating-gate or antifuse-based technology
  • Interface: SPI, BPI, or parallel bus
  • Voltage rails: 1.2V-3.3V operation with decoupling capacitors
  • Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

ParameterSignificance
Memory density (1Mb-4Gb)Determines maximum FPGA configuration size
Access time (55ns-120ns)Impacts system boot speed
Endurance (10k-100k cycles)Dictates reprogramming lifespan
Data retention (20-100 years)Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)Essential for space applications

5. Application Areas

Primary application domains:

  • Telecommunications: 5G NR base stations, optical transceivers
  • Industrial: Programmable logic controllers (PLCs)
  • Medical: MRI scanners, patient monitoring systems
  • Automotive: ADAS sensor fusion units
  • Defense: Radar signal processing systems

6. Key Manufacturers and Products

ManufacturerProduct SeriesKey Features
MicrochipAT17F Series128Mb SPI interface, -40 C to +125 C
IntelEP180SSecure boot, TSMC 16nm process
XilinxS25FL-VOctal SPI, 400MHz clock rate
CypressFL-S SeriesEnd-to-end data protection

7. Selection Guidelines

Key selection factors:

  • Match memory density to target FPGA's bitstream size
  • Verify interface compatibility (SPI/BPI/parallel)
  • Evaluate environmental requirements (temperature, radiation)
  • Assess security features (encryption, authentication)
  • Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

  • Transition to 3D NAND architecture for densities beyond 8Gb
  • Integration of hardware security modules (HSM)
  • Adoption of JEDEC Xccela interface for >400MB/s throughput
  • Development of radiation-tolerant devices for LEO satellites
  • Implementation of AI-driven wear-leveling algorithms
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