Memory - Configuration Proms for FPGAs

Image Part Number Description / PDF Quantity Rfq
EPC4QC100N

EPC4QC100N

Flip Electronics

CONFIGURATION MEMORY, 4MX1, PQFP

743

AT17F040A-30JC

AT17F040A-30JC

Atmel (Microchip Technology)

CONFIG MEMORY, 4MX1, SERIAL

53

XC1765EVO8I

XC1765EVO8I

Xilinx

CONFIG MEMORY, 64KX1, SERIAL

3986

XC17V01SO20I

XC17V01SO20I

Xilinx

CONFIG MEMORY, 1MX1, SERIAL

3464

AT17LV512A-10PC

AT17LV512A-10PC

Atmel (Microchip Technology)

CONFIG MEMORY, 512KX1, SERIAL

720

AT17LV512-10CU

AT17LV512-10CU

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 512K 8-LAP

53

AT17LV010-10PU

AT17LV010-10PU

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 1M 8-DIP

309

XC17256ELVO8C

XC17256ELVO8C

Xilinx

CONFIG MEMORY, 256KX1, SERIAL

1464

EPCQ64ASI16N

EPCQ64ASI16N

Intel

IC CONFIG DEVICE 64MBIT 16SOIC

0

AT17F16A-30JU

AT17F16A-30JU

Roving Networks / Microchip Technology

IC FLASH CONFIG 16M 20PLCC

0

AT17F040A-30CU

AT17F040A-30CU

Roving Networks / Microchip Technology

IC FLASH CONFIG 4M 8LAP

95

XC18V512SO20C

XC18V512SO20C

Xilinx

IC PROM SRL CONFIG 512K 20-SOIC

0

AT17F040A-30JI

AT17F040A-30JI

Atmel (Microchip Technology)

CONFIG MEMORY, 4MX1, SERIAL

33

AT17LV002-10JU

AT17LV002-10JU

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 2M 20-PLCC

12

XC18V512PCG20C

XC18V512PCG20C

Xilinx

IC PROM REPROGR 512KB 20-PLCC

0

AT17LV512-10SC

AT17LV512-10SC

Roving Networks / Microchip Technology

IC CONFIG SEEPROM 512K 20SOIC

34

XC1765ELPC20C

XC1765ELPC20C

Xilinx

CONFIG MEMORY, 64KX1, SERIAL

4341

EPCQ4ASI8N

EPCQ4ASI8N

Intel

IC CONFIG DEVICE 4MBIT 8SOIC

8356

XC18V04VQG44C

XC18V04VQG44C

Xilinx

IC PROM REPROGR 4MB 44-VQFP

0

AT17F040A-30JU

AT17F040A-30JU

Roving Networks / Microchip Technology

IC FLASH CONFIG 4M 20PLCC

77

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
OTP PROMsOne-Time Programmable, low cost, high reliabilityIndustrial control systems
Flash PROMsReprogrammable, high density, moderate endurance5G base stations
EEPROMByte-alterable, high endurance, slower access speedMedical imaging equipment
FRAMLow-power, radiation-hardened, fast write speedAerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

  • Package types: TSSOP, VQFN, BGA
  • Memory array: Floating-gate or antifuse-based technology
  • Interface: SPI, BPI, or parallel bus
  • Voltage rails: 1.2V-3.3V operation with decoupling capacitors
  • Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

ParameterSignificance
Memory density (1Mb-4Gb)Determines maximum FPGA configuration size
Access time (55ns-120ns)Impacts system boot speed
Endurance (10k-100k cycles)Dictates reprogramming lifespan
Data retention (20-100 years)Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)Essential for space applications

5. Application Areas

Primary application domains:

  • Telecommunications: 5G NR base stations, optical transceivers
  • Industrial: Programmable logic controllers (PLCs)
  • Medical: MRI scanners, patient monitoring systems
  • Automotive: ADAS sensor fusion units
  • Defense: Radar signal processing systems

6. Key Manufacturers and Products

ManufacturerProduct SeriesKey Features
MicrochipAT17F Series128Mb SPI interface, -40 C to +125 C
IntelEP180SSecure boot, TSMC 16nm process
XilinxS25FL-VOctal SPI, 400MHz clock rate
CypressFL-S SeriesEnd-to-end data protection

7. Selection Guidelines

Key selection factors:

  • Match memory density to target FPGA's bitstream size
  • Verify interface compatibility (SPI/BPI/parallel)
  • Evaluate environmental requirements (temperature, radiation)
  • Assess security features (encryption, authentication)
  • Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

  • Transition to 3D NAND architecture for densities beyond 8Gb
  • Integration of hardware security modules (HSM)
  • Adoption of JEDEC Xccela interface for >400MB/s throughput
  • Development of radiation-tolerant devices for LEO satellites
  • Implementation of AI-driven wear-leveling algorithms
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