Memory - Configuration Proms for FPGAs

Image Part Number Description / PDF Quantity Rfq
AT17LV128-10NI

AT17LV128-10NI

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

10

AT17LV002A-10JU

AT17LV002A-10JU

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 2M 20-PLCC

24

AT17LV002-10TQI

AT17LV002-10TQI

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 2M 44TQFP

86

AT17F080A-30JU

AT17F080A-30JU

Roving Networks / Microchip Technology

IC FLASH CONFIG 8M 20PLCC

75

AT17LV512-10SI

AT17LV512-10SI

Roving Networks / Microchip Technology

IC CONFIG SEEPROM 512K 20SOIC

23

AT17LV128-10SI

AT17LV128-10SI

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

1345

XC1765EVO8C

XC1765EVO8C

Xilinx

CONFIG MEMORY, 64KX1, SERIAL

575

XC1765ESOG8C

XC1765ESOG8C

Xilinx

CONFIG MEMORY, 64KX1, SERIAL

1035

XC18V512SOG20C

XC18V512SOG20C

Xilinx

IC PROM REPROGR 512KB 20-SOIC

0

XCF16PFSG48C

XCF16PFSG48C

Xilinx

IC PROM SRL 1.8V 16M 48CSBGA

20

AT17LV128-10SC

AT17LV128-10SC

Atmel (Microchip Technology)

CONFIG MEMORY, 128KX1

3172

AT17F080-30CU

AT17F080-30CU

Roving Networks / Microchip Technology

IC FLASH CONFIG 8M 8LAP

64

AT17LV512A-10JI

AT17LV512A-10JI

Atmel (Microchip Technology)

CONFIG MEMORY, 512KX1, SERIAL

746

AT17F040A-30QC

AT17F040A-30QC

Roving Networks / Microchip Technology

IC FLASH CONFIG 4M 32TQFP

2

XCF08PVO48C0973

XCF08PVO48C0973

Xilinx

CONFIG MEMORY, 8MX1, SERIAL

10395

XC17256ELPC20C

XC17256ELPC20C

Xilinx

CONFIG MEMORY, 256KX1, SERIAL

2131

EPC1064LI20

EPC1064LI20

Altera (Intel)

CONFIG MEMORY, 64KX1, SERIAL

356

XC17S150XLSO20C

XC17S150XLSO20C

Xilinx

CONFIG MEMORY, 1M BITS, SERIAL

550

XC18V04VQ44C

XC18V04VQ44C

Xilinx

IC PROM SRL FOR 4M GATE 44-VQFP

169

EPCQ32ASI8N

EPCQ32ASI8N

Intel

IC CONFIG DEVICE 32MBIT 8SOIC

1488

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
OTP PROMsOne-Time Programmable, low cost, high reliabilityIndustrial control systems
Flash PROMsReprogrammable, high density, moderate endurance5G base stations
EEPROMByte-alterable, high endurance, slower access speedMedical imaging equipment
FRAMLow-power, radiation-hardened, fast write speedAerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

  • Package types: TSSOP, VQFN, BGA
  • Memory array: Floating-gate or antifuse-based technology
  • Interface: SPI, BPI, or parallel bus
  • Voltage rails: 1.2V-3.3V operation with decoupling capacitors
  • Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

ParameterSignificance
Memory density (1Mb-4Gb)Determines maximum FPGA configuration size
Access time (55ns-120ns)Impacts system boot speed
Endurance (10k-100k cycles)Dictates reprogramming lifespan
Data retention (20-100 years)Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)Essential for space applications

5. Application Areas

Primary application domains:

  • Telecommunications: 5G NR base stations, optical transceivers
  • Industrial: Programmable logic controllers (PLCs)
  • Medical: MRI scanners, patient monitoring systems
  • Automotive: ADAS sensor fusion units
  • Defense: Radar signal processing systems

6. Key Manufacturers and Products

ManufacturerProduct SeriesKey Features
MicrochipAT17F Series128Mb SPI interface, -40 C to +125 C
IntelEP180SSecure boot, TSMC 16nm process
XilinxS25FL-VOctal SPI, 400MHz clock rate
CypressFL-S SeriesEnd-to-end data protection

7. Selection Guidelines

Key selection factors:

  • Match memory density to target FPGA's bitstream size
  • Verify interface compatibility (SPI/BPI/parallel)
  • Evaluate environmental requirements (temperature, radiation)
  • Assess security features (encryption, authentication)
  • Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

  • Transition to 3D NAND architecture for densities beyond 8Gb
  • Integration of hardware security modules (HSM)
  • Adoption of JEDEC Xccela interface for >400MB/s throughput
  • Development of radiation-tolerant devices for LEO satellites
  • Implementation of AI-driven wear-leveling algorithms
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