Memory

Part Number	Description / PDF	Quantity
M95256-DRDW8TP/K STMicroelectronics	IC EEPROM 256KBIT SPI 8TSSOP	1573
M95160-DFMC6TG STMicroelectronics	IC EEPROM 16KBIT SPI 8UFDFPN	4325
M24C16-FMC5TG STMicroelectronics	IC EEPROM 16KBIT I2C 400KHZ 8MLP	0
M93C76-RDW3TP/K STMicroelectronics	IC EEPROM 4KBIT SPI 2MHZ 8TSSOP	0
M95320-DFMC6TG STMicroelectronics	IC EEPROM 32KBIT SPI 20MHZ 8MLP	0
M95128-DRDW8TP/K STMicroelectronics	IC EEPROM 128KBIT SPI 8TSSOP	0
M24512-DFMN6TP STMicroelectronics	IC EEPROM 512KBIT I2C 1MHZ 8SO	6962
M93C46-WMN6TP STMicroelectronics	IC EEPROM 1KBIT SPI 2MHZ 8SO	12
M24256-BFDW6TP STMicroelectronics	IC EEPROM 256KBIT I2C 8TSSOP	2979
M24256-BWMN6TP STMicroelectronics	IC EEPROM 256KBIT I2C 1MHZ 8SO	1833
M48Z32V-35MT1F STMicroelectronics	IC NVSRAM 256KBIT PARALLEL 44SO	0
M95010-WDW6TP STMicroelectronics	IC EEPROM 1KBIT SPI 20MHZ 8TSSOP	6415
M95128-DRMN3TP/K STMicroelectronics	IC EEPROM 128KBIT SPI 20MHZ 8SO	0
M95640-DRDW8TP/K STMicroelectronics	IC EEPROM 64KBIT SPI 8TSSOP	3928
M95020-DRMN3TP/K STMicroelectronics	IC EEPROM 2KBIT SPI 20MHZ 8SO	6705
M95080-WDW6TP STMicroelectronics	IC EEPROM 8KBIT SPI 20MHZ 8TSSOP	1549
M24512-DFDW6TP STMicroelectronics	IC EEPROM 512KBIT I2C 8TSSOP	2457
M24C16-DRMN8TP/K STMicroelectronics	IC EEPROM 16KBIT I2C 1MHZ 8SO	3633
M24M02-DRMN6TP STMicroelectronics	IC EEPROM 2MBIT I2C 1MHZ 8SO	0
M24512-WMN6TP STMicroelectronics	IC EEPROM 512KBIT I2C 1MHZ 8SO	20466

Memory

1. Overview

Memory integrated circuits (ICs) are semiconductor devices used for storing digital data in electronic systems. As fundamental components of modern electronics, they enable data retention and retrieval in computers, mobile devices, industrial equipment, and automotive systems. Memory ICs are categorized into volatile (requires power to retain data) and non-volatile (retains data without power) types, playing critical roles in system performance, storage capacity, and energy efficiency.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
DRAM (Dynamic RAM)	High-density, low-cost, requires periodic refresh	PCs, Servers, Graphics Cards
NAND Flash	Non-volatile, high endurance, block-level access	SSDs, USB Drives, Mobile Storage
SRAM (Static RAM)	High-speed, low density, no refresh required	Cache Memory, Networking Equipment
NOR Flash	Random access, execute-in-place capability	Embedded Systems, Automotive ECUs
MRAM (Magnetoresistive RAM)	Non-volatile, unlimited endurance, low power	IoT Devices, Industrial Sensors

3. Structure and Composition

Memory ICs typically consist of:

Storage Cell Array: Matrix of memory cells (transistors/capacitors for DRAM, floating-gate transistors for Flash)
Address Decoder: Selects specific memory locations
I/O Circuits: Data input/output interfaces
Control Logic: Manages read/write operations and timing
Power Management Units: Optimizes energy consumption

Advanced packages include BGA (Ball Grid Array) and 3D-stacked configurations for density optimization.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	Data volume (Gb/GiB)	Determines system memory limits
Access Time	ns/predictable latency	Impacts processing speed
Power Consumption	mW/MHz	Affects battery life and thermal design
Endurance	P/E cycles (Flash)	Dictates product lifespan
Data Retention	Years (non-volatile)	Critical for long-term storage

5. Application Areas

Consumer Electronics: Smartphones (NAND Flash), Gaming Consoles (GDDR6)
Industrial Automation: PLCs (SRAM), Data Loggers (MRAM)
Automotive Systems: ADAS (LPDDR5), Infotainment (eMMC)
Enterprise Storage: SSD Controllers (3D NAND), Servers (RDIMM)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Samsung Electronics	V-NAND (9x-layer), LPDDR5X
SK hynix	HBM3 (8GB/s bandwidth), GDDR6
Microchip Technology	Serial NOR Flash (SST26)
Kioxia Corporation	BiCS FLASH (3D NAND)
Infineon Technologies	MRAM (40nm process)

7. Selection Recommendations

Key considerations:

Match memory type to application requirements (e.g., NOR Flash for code storage)
Evaluate bandwidth vs. latency tradeoffs
Analyze temperature and vibration specifications
Assess long-term supply stability
Optimize cost-per-bit metrics

Case Study: A smartphone manufacturer selected UFS 3.1 (NAND-based) for 2100MB/s read speeds, improving app launch times by 35%.

8. Industry Trends

Future directions include:

3D NAND scaling beyond 200 layers
Emerging memories (ReRAM, PCM) for AI acceleration
Package-on-Package (PoP) integration
AI-optimized memory architectures (Processing-in-Memory)
Green manufacturing processes (EUV lithography)