Logic - Universal Bus Functions

Part Number	Description / PDF	Quantity
74AVC16834ADGV,112 NXP Semiconductors	BUS DRIVER	1050
SN74ABT16601DGGR Texas Instruments	SN74ABT16601 18-BIT UNIVERSAL BU	19613
74ALVTH16601DLG4 Texas Instruments	IC UNIV BUS TXRX 18BIT 56SSOP	0
SN74ALVCHR16269AGR Texas Instruments	BUS EXCHANGER, ALVC/VCX/A SERIES	24219
MM74HC299WM	PARALLEL IN PARALLEL OUT	0
SN74ALVCHG162282GR Texas Instruments	BUS EXCHANGER, ALVC/VCX/A SERIES	1985
SN74ALVCH16334DGGR Texas Instruments	BUS DRIVER	6000
SN74ALVCH16501KR Texas Instruments	REGISTERED BUS TRANSCEIVER	11624
SN74ALVCH162334DL Texas Instruments	SN74ALVCH162334 16-BIT UNIVERSAL	14949
SN74ALVC16834DGVR Texas Instruments	BUS DRIVER	2000
SN74LVTH16835DGGR Texas Instruments	SN74LVTH16835 3.3-V ABT 18-BIT U	7957
74ALVCH16501DL,112 Nexperia	IC 18BIT UNVRSL BUS TXRX 56-SSOP	0
GTLP16612MEAX	REGISTERED BUS TRANSCEIVER	5000
SN74ALVCH162836DL Texas Instruments	BUS DRIVER	25601
CY74FCT16501ATPVCT Texas Instruments	REGISTERED BUS TRANSCEIVER	1000
NLVVHC1G32DFT2	OR GATE 2-IN CMOS 5PIN SC-70 T/R	6000
74LVTH16501DGGRE4 Texas Instruments	IC UNIV BUS TXRX 18BIT 56TSSOP	0
SN74ALVTH16601DLR Texas Instruments	SN74ALVTH16601 2.5-V/3.3-V 18-BI	4900
SN74LVT16501DGGR Texas Instruments	REGISTERED BUS TRANSCEIVER, LVT	69717
SN74LVTH16500DL Texas Instruments	SN74LVTH16500 3.3-V ABT 18-BIT U	4893

Logic - Universal Bus Functions

1. Overview

Universal Bus Function ICs are logic devices designed to manage data transfer between different components in electronic systems. They provide critical interface capabilities for voltage level translation, signal buffering, bus arbitration, and protocol conversion. These ICs are essential in modern electronics for enabling compatibility between devices with different electrical and logical characteristics.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bus Transceivers	Dual-directional data transfer with 3-state I/O ports	Memory interfaces, PCI Express buses
Bus Buffers	Signal amplification and isolation	Industrial control backplanes
Level Translators	Voltage conversion between 1.2V-5V domains	Multivoltage SoC interfaces
Bus Controllers	Protocol management and arbitration logic	USB host controllers, CAN bus systems

3. Structure and Composition

Typical physical structure includes:

Plastic/ceramic package (TSSOP, QFN, BGA variants)
Multiple channel configurations (4/8/16-bit)
Internal components: logic gates, buffer amplifiers, clamping diodes
ESD protection structures on I/O pins
Power rails with decoupling capacitors

4. Key Technical Specifications

Parameter	Significance
Voltage Range (1.2V-5.5V)	Defines compatibility with host systems
Data Rate (up to 500Mbps)	Determines maximum bus throughput
Drive Strength ( 24mA)	Affects signal integrity over long traces
Propagation Delay (<2ns)	Critical for timing-sensitive applications
ESD Rating ( 8kV HBM)	Reliability indicator in industrial environments

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical modules)
Automotive (CAN-FD interfaces, ADAS systems)
Industrial Automation (PLC backplanes, motor controllers)
Consumer Electronics (smartphones, SSD interfaces)

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
TI	SN74LVC16T245	1.2V-3.6V operation, 64-pin TSSOP
NXP	74ALVC164245	2.3V-3.6V, 24mA drive current
STMicro	LVC1G125	Single-channel buffer in SOT23-5
Intel	I3TBUF0242	1.7V-5.5V, hot-swap capability

7. Selection Recommendations

Key considerations:

Voltage compatibility with existing bus standards
Required data bandwidth and timing margins
Package size constraints (BGA vs TSSOP)
Temperature rating for industrial/military use
Cost vs. integrated features trade-off

8. Industry Trends

Current development directions include:

Migration to 10+ Gbps data rates for 5G applications
Integration with protocol-specific accelerators
Adoption of advanced packaging (3D stacking)
Enhanced EMI reduction techniques
Support for emerging standards like CXL and UCIe