Logic - Universal Bus Functions

Image Part Number Description / PDF Quantity Rfq
74VCXF162835MTX

74VCXF162835MTX

BUS DRIVER

8886

CY74FCT162500CTPVC

CY74FCT162500CTPVC

Texas Instruments

REGISTERED BUS TRANSCEIVER

320

SN74ALVCHR16269AL

SN74ALVCHR16269AL

Texas Instruments

BUS EXCHANGER, ALVC/VCX/A SERIES

13510

SN74ALVCH32501KR

SN74ALVCH32501KR

Texas Instruments

REGISTERED BUS TRANSCEIVER

8919

SN74VMEH22501AGQLR

SN74VMEH22501AGQLR

Texas Instruments

REGISTERED BUS TRANSCEIVER

29000

74VCX16501MTDX

74VCX16501MTDX

REGISTERED BUS TRANSCEIVER

925

SN74LVTH18512DGGR

SN74LVTH18512DGGR

Texas Instruments

IC SCAN TEST UNIV TXRX 64TSSOP

1032

SN74ALVC16334DL

SN74ALVC16334DL

Texas Instruments

SN74ALVC16334 16-BIT UNIVERSAL B

25064

74ALVC16835PFG

74ALVC16835PFG

3.3V 18-BIT UNIVERSAL BUS DRIVER

8518

SN74ALVCH16835DGVR

SN74ALVCH16835DGVR

Texas Instruments

SN74ALVCH16835 18-BIT UNIVERSAL

5400

SN74ALVCH16903DL

SN74ALVCH16903DL

Texas Instruments

SN74ALVCH16903 3.3-V 12-BIT UNIV

8060

74FCT162500CTPVCT

74FCT162500CTPVCT

Texas Instruments

REGISTERED BUS TRANSCEIVER

4000

74ALVCH32501ZKFR

74ALVCH32501ZKFR

Texas Instruments

SN74ALVCH32501 36-BIT UNIVERSAL

80000

SN74AVC16334DGGR

SN74AVC16334DGGR

Texas Instruments

SN74AVC16334 16-BIT UNIVERSAL BU

16000

SN74ALVCH16269DLR

SN74ALVCH16269DLR

Texas Instruments

BUS EXCHANGER, ALVC/VCX/A SERIES

4000

74ALVCH16601DGGS

74ALVCH16601DGGS

Nexperia

IC UNIV BUS TXRX 18BIT 56TSSOP

0

SN74ALVTH16601GR

SN74ALVTH16601GR

Texas Instruments

SN74ALVTH16601 2.5-V/3.3-V 18-BI

2860

SCAN16512ASM

SCAN16512ASM

BOUNDARY SCAN BUS TRANSCVR

3232

74LVTH16835MTD

74LVTH16835MTD

BUS DRIVER, LVT SERIES

1912

74HC299N,652

74HC299N,652

NXP Semiconductors

PARALLEL IN PARALLEL OUT

1173

Logic - Universal Bus Functions

1. Overview

Universal Bus Function ICs are logic devices designed to manage data transfer between different components in electronic systems. They provide critical interface capabilities for voltage level translation, signal buffering, bus arbitration, and protocol conversion. These ICs are essential in modern electronics for enabling compatibility between devices with different electrical and logical characteristics.

2. Major Types and Functional Classification

Type Functional Characteristics Application Examples
Bus Transceivers Dual-directional data transfer with 3-state I/O ports Memory interfaces, PCI Express buses
Bus Buffers Signal amplification and isolation Industrial control backplanes
Level Translators Voltage conversion between 1.2V-5V domains Multivoltage SoC interfaces
Bus Controllers Protocol management and arbitration logic USB host controllers, CAN bus systems

3. Structure and Composition

Typical physical structure includes:

  • Plastic/ceramic package (TSSOP, QFN, BGA variants)
  • Multiple channel configurations (4/8/16-bit)
  • Internal components: logic gates, buffer amplifiers, clamping diodes
  • ESD protection structures on I/O pins
  • Power rails with decoupling capacitors

4. Key Technical Specifications

Parameter Significance
Voltage Range (1.2V-5.5V) Defines compatibility with host systems
Data Rate (up to 500Mbps) Determines maximum bus throughput
Drive Strength ( 24mA) Affects signal integrity over long traces
Propagation Delay (<2ns) Critical for timing-sensitive applications
ESD Rating ( 8kV HBM) Reliability indicator in industrial environments

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical modules)
  • Automotive (CAN-FD interfaces, ADAS systems)
  • Industrial Automation (PLC backplanes, motor controllers)
  • Consumer Electronics (smartphones, SSD interfaces)

6. Leading Manufacturers and Products

Manufacturer Product Series Key Features
TI SN74LVC16T245 1.2V-3.6V operation, 64-pin TSSOP
NXP 74ALVC164245 2.3V-3.6V, 24mA drive current
STMicro LVC1G125 Single-channel buffer in SOT23-5
Intel I3TBUF0242 1.7V-5.5V, hot-swap capability

7. Selection Recommendations

Key considerations:

  • Voltage compatibility with existing bus standards
  • Required data bandwidth and timing margins
  • Package size constraints (BGA vs TSSOP)
  • Temperature rating for industrial/military use
  • Cost vs. integrated features trade-off

8. Industry Trends

Current development directions include:

  • Migration to 10+ Gbps data rates for 5G applications
  • Integration with protocol-specific accelerators
  • Adoption of advanced packaging (3D stacking)
  • Enhanced EMI reduction techniques
  • Support for emerging standards like CXL and UCIe
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