Logic - Universal Bus Functions

Image Part Number Description / PDF Quantity Rfq
74ALVCH16600DGGS

74ALVCH16600DGGS

Nexperia

IC UNIV BUS TXRX 18BIT 56TSSOP

0

SN74ALVCH162601GR

SN74ALVCH162601GR

Texas Instruments

SN74ALVCH162601 18-BIT UNIVERSAL

40147

74FCT162H501CTPVC

74FCT162H501CTPVC

Texas Instruments

REGISTERED BUS TRANSCEIVER

20060

SN74ALVCH162601DL

SN74ALVCH162601DL

Texas Instruments

IC UNIV BUS TXRX 18BIT 56SSOP

340

SN74AVC16269DGGR

SN74AVC16269DGGR

Texas Instruments

BUS EXCHANGER

10000

SN74ABT16600DLR

SN74ABT16600DLR

Texas Instruments

REGISTERED BUS TRANSCEIVER

3000

MAX4121CSA+

MAX4121CSA+

Analog Devices, Inc.

VIDEO SWITCHES/XPOINT

0

SN74ALVC162334DL

SN74ALVC162334DL

Texas Instruments

BUS DRIVER

12276

SN74ALVC162835DLR

SN74ALVC162835DLR

Texas Instruments

BUS DRIVER

1000

NLVAC157DR2G

NLVAC157DR2G

MUX 1-ELEMENT CMOS 8-IN

7500

SN74LVT16501DLR

SN74LVT16501DLR

Texas Instruments

REGISTERED BUS TRANSCEIVER

13022

74LVTH16501DLRG4

74LVTH16501DLRG4

Texas Instruments

IC UNIV BUS TXRX 18BIT 56SSOP

0

74HC299D,653

74HC299D,653

Nexperia

IC UNIV SHIFT REGISTER 20SOIC

0

SN74ABT162601DGGR

SN74ABT162601DGGR

Texas Instruments

IC UNIV BUS TXRX 18BIT 56TSSOP

0

74ALVCH162601DGGS

74ALVCH162601DGGS

Nexperia

IC UNIV BUS TXRX 18BIT 56TSSOP

0

SN74LVTH18511DGGR

SN74LVTH18511DGGR

Texas Instruments

BOUNDARY SCAN TRANSCEIVER

4000

SN74LVT16835DGGR

SN74LVT16835DGGR

Texas Instruments

BUS DRIVER, LVT SERIES

17880

SN74ALVC16835GQLR

SN74ALVC16835GQLR

Texas Instruments

BUS DRIVER

8000

SN74AUC16501DGGR

SN74AUC16501DGGR

Texas Instruments

REGISTERED BUS TRANSCEIVER

4000

SN74ALVCH16282DBBR

SN74ALVCH16282DBBR

Texas Instruments

BUS EXCHANGER, ALVC/VCX/A SERIES

19500

Logic - Universal Bus Functions

1. Overview

Universal Bus Function ICs are logic devices designed to manage data transfer between different components in electronic systems. They provide critical interface capabilities for voltage level translation, signal buffering, bus arbitration, and protocol conversion. These ICs are essential in modern electronics for enabling compatibility between devices with different electrical and logical characteristics.

2. Major Types and Functional Classification

Type Functional Characteristics Application Examples
Bus Transceivers Dual-directional data transfer with 3-state I/O ports Memory interfaces, PCI Express buses
Bus Buffers Signal amplification and isolation Industrial control backplanes
Level Translators Voltage conversion between 1.2V-5V domains Multivoltage SoC interfaces
Bus Controllers Protocol management and arbitration logic USB host controllers, CAN bus systems

3. Structure and Composition

Typical physical structure includes:

  • Plastic/ceramic package (TSSOP, QFN, BGA variants)
  • Multiple channel configurations (4/8/16-bit)
  • Internal components: logic gates, buffer amplifiers, clamping diodes
  • ESD protection structures on I/O pins
  • Power rails with decoupling capacitors

4. Key Technical Specifications

Parameter Significance
Voltage Range (1.2V-5.5V) Defines compatibility with host systems
Data Rate (up to 500Mbps) Determines maximum bus throughput
Drive Strength ( 24mA) Affects signal integrity over long traces
Propagation Delay (<2ns) Critical for timing-sensitive applications
ESD Rating ( 8kV HBM) Reliability indicator in industrial environments

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical modules)
  • Automotive (CAN-FD interfaces, ADAS systems)
  • Industrial Automation (PLC backplanes, motor controllers)
  • Consumer Electronics (smartphones, SSD interfaces)

6. Leading Manufacturers and Products

Manufacturer Product Series Key Features
TI SN74LVC16T245 1.2V-3.6V operation, 64-pin TSSOP
NXP 74ALVC164245 2.3V-3.6V, 24mA drive current
STMicro LVC1G125 Single-channel buffer in SOT23-5
Intel I3TBUF0242 1.7V-5.5V, hot-swap capability

7. Selection Recommendations

Key considerations:

  • Voltage compatibility with existing bus standards
  • Required data bandwidth and timing margins
  • Package size constraints (BGA vs TSSOP)
  • Temperature rating for industrial/military use
  • Cost vs. integrated features trade-off

8. Industry Trends

Current development directions include:

  • Migration to 10+ Gbps data rates for 5G applications
  • Integration with protocol-specific accelerators
  • Adoption of advanced packaging (3D stacking)
  • Enhanced EMI reduction techniques
  • Support for emerging standards like CXL and UCIe
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