Logic - Translators, Level Shifters

Part Number	Description / PDF	Quantity
MAX9372EUA+T Maxim Integrated	IC TRNSLTR UNIDIRECTIONAL 8UMAX	7500
MC100ELT21DR2	PECL TO TTL TRANSLATOR	3905
TCA9406DCUR Texas Instruments	IC TRNSLTR BIDIRECTIONAL US8	0
SN65EPT22DGK Texas Instruments	IC TRNSLTR UNIDIRECTIONAL 8VSSOP	548
SY100EPT28LKG Roving Networks / Microchip Technology	IC TRNSLTR UNIDIRECTIONAL 8MSOP	975
SN74GTLP21395GQNR Texas Instruments	BUS TRANSCEIVER	19000
MC10H605FNR2G	ECL TO TTL TRANSLATOR	3008
MAX3002EBP Analog Devices, Inc.	INTERFACE CIRCUIT, BICMOS, PBGA2	13967
MC100H605FNG	ECL TO TTL TRANSLATOR	803
MAX3012EBP Analog Devices, Inc.	8-CH LEVEL TRANSLATOR	219
NB100ELT23LDR2	PECL TO TTL TRANSLATOR	34895
MAX9181EXT-T Analog Devices, Inc.	LOW-JITTER, LOW-NOISE LVPECL-TO-	2500
PI4GTL2034LEX Zetex Semiconductors (Diodes Inc.)	IC TRNSLTR UNIDIR 14TSSOP	1000
74AXP1T125GSH NXP Semiconductors	BUS DRIVER, AXP SERIES, 1-FUNC,	115000
NLSX5014MUTAG	INTERFACE CIRCUIT	740
74ALVC164245ZRDR Texas Instruments	SN74ALVC164245 16-BIT 2.5-V TO 3	0
ADG3301BKSZ-REEL7 Analog Devices, Inc.	IC TRNSLTR BIDIRECTIONAL SC70	15941
NLSX3018DWR2G Sanyo Semiconductor/ON Semiconductor	IC TRNSLTR BIDIRECTIONAL 20SOIC	771
MC10H605FNG	ECL TO TTL TRANSLATOR	1720
MC100ELT25D	ECL TO TTL TRANSLATOR	18796

Logic - Translators, Level Shifters

1. Overview

Logic translators and level shifters are semiconductor devices that enable signal compatibility between circuits operating at different voltage levels. These ICs ensure reliable data transmission by converting logic signals from one voltage domain to another, maintaining signal integrity in mixed-voltage systems. Their importance has grown with the proliferation of low-voltage CMOS technologies and multi-rail power architectures in modern electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-direction translators	Unidirectional voltage conversion with isolation	SPI interface between 3.3V FPGA and 1.8V sensors
Bi-directional translators	Automatic direction detection, dual-voltage I/O	I2C bus bridging between 5V microcontroller and 2.5V EEPROM
Multi-channel level shifters	Parallel conversion of multiple signals (4-32 channels)	Memory interface between SoC and DDR4 SDRAM modules
Direction-controlled translators	External control pin for signal direction selection	UART level conversion in industrial communication modules

3. Structure and Composition

Typical devices feature a monolithic CMOS structure with dual power supply inputs (VCCA and VCCB). Physical components include:

Dual-supply MOSFET pairs for voltage translation
Integrated clamp circuits for ESD protection
Direction control logic (for bidirectional types)
Channel-specific enable/disable circuitry

Common package types: TSSOP (14-48 pins), QFN (20-64 pins), WLCSP (1.5 1.5mm ultra-compact).

4. Key Technical Specifications

Parameter	Significance
Voltage range (1.2V-5.5V)	Determines compatibility with different logic families
Conversion rate (100Mbps-1.2Gbps)	Limits maximum operating frequency
Channel count (1-32)	Impacts system integration density
Propagation delay (2-20ns)	Affects timing critical applications
Quiescent current (1-100 A)	Power efficiency in battery-powered systems

5. Application Areas

Key industries include:

Telecommunications: 5G baseband processors interfacing with RF front-ends
Industrial automation: PLC modules connecting 24V sensors to 3.3V MCUs
Consumer electronics: Smartphone PMIC to application processor communication
Automotive systems: CAN-FD transceiver voltage adaptation
IoT devices: Sensor hub interfacing between different voltage rail components

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	TXB0108	8-channel, 1.2-3.6V to 1.65-5.5V translation, auto-direction detection
NXP Semiconductors	LTC2850	3.3/5V dual supply, 15kV ESD protection, RS485/UART interface
ON Semiconductor	NXU408	4-channel, 0.9-5.5V range, sub-1ns propagation delay
STMicroelectronics	L6470	Stepper motor driver with integrated level shifting for industrial automation

7. Selection Guidelines

Key considerations:

Match supply voltage ranges with source/target systems
Ensure conversion rate meets timing requirements
Choose appropriate channel density to minimize PCB area
For bidirectional buses, select devices with automatic direction sensing
Consider thermal performance for high-current applications
Evaluate ESD protection levels for industrial environments

8. Industry Trends

Development directions include:

Voltage scaling down to 0.8V core operation
Integration with signal conditioning functions
Increased adoption of capacitive isolation technology
Advanced packaging (3D TSV, fan-out WLP)
Protocol-aware smart translation (I3C, PCIe 6.0)