Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
CY7C4241V-15JXC

CY7C4241V-15JXC

FIFO, 4KX9, 11NS, SYNCHRONOUS

488

72V3670L6PFG8

72V3670L6PFG8

Renesas Electronics America

IC FIFO SS 8192X36 6NS 128-TQFP

0

QS7201-20P

QS7201-20P

QUALITY SEMI FIFO 512X ASYNC

3664

QS7203-80JR

QS7203-80JR

FIFO, 2KX9, 80NS, ASYNCHRONOUS

480

7283L15PAGI8

7283L15PAGI8

Renesas Electronics America

IC MEM FIFO 2048X9 15NS 56-TSSOP

0

72V3623L10PFG

72V3623L10PFG

Renesas Electronics America

IC FIFO 256X36 SYNC 10NS 128TQFP

0

74F403SPC

74F403SPC

Rochester Electronics

FIFO, 16X4, SYNCHRONOUS, TTL, PD

1873

7200L12JG8

7200L12JG8

Renesas Electronics America

IC MEM FIFO 256X9 12NS 32-PLCC

0

SN74ACT7802-60FN

SN74ACT7802-60FN

Texas Instruments

FIFO, 1KX18, 45NS, SYNCHRONOUS

1554

72221L10JG8

72221L10JG8

Renesas Electronics America

IC FIFO SYNC 1KX9 10NS 32PLCC

0

CY7C4281V-10JC

CY7C4281V-10JC

Rochester Electronics

FIFO, 64KX9, 8NS, SYNCHRONOUS

73

CY7C429-20JXC

CY7C429-20JXC

IR (Infineon Technologies)

FIFO, 2KX9, 20NS, ASYNCHRONOUS

636

SN74ABT7819A-12PN

SN74ABT7819A-12PN

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18

268

SN74ACT7813-40DLR

SN74ACT7813-40DLR

Texas Instruments

FIFO, 64X18, 20NS, SYNCHRONOUS

1000

7202LA15JGI8

7202LA15JGI8

Renesas Electronics America

IC FIFO ASYNCH 1KX9 15NS 32PLCC

0

CY7C425-10JXC

CY7C425-10JXC

IR (Infineon Technologies)

FIFO, 1KX9, 10NS, ASYNCHRONOUS

0

SN74ALVC7806-40DL

SN74ALVC7806-40DL

Texas Instruments

SN74ALVC7806 256 X 18 3.3-V ASYN

367

72V01L25JGI

72V01L25JGI

Renesas Electronics America

IC FIFO 512X9 25NS 32-PLCC

672

SN74ABT7819-30PN

SN74ABT7819-30PN

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18

92

CY7C429-65JC

CY7C429-65JC

Rochester Electronics

FIFO, 2KX9, 65NS, ASYNCHRONOUS

455

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

RFQ BOM Call Skype Email
Top