Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
QS72225-25TF

QS72225-25TF

QUALITY SEMI FIFO 1KX18 SYNC

452

72V3680L6PFG

72V3680L6PFG

Renesas Electronics America

IC FIFO SYNC 16384X36 128QFP

0

72265LA10PFG

72265LA10PFG

Renesas Electronics America

IC FIFO SUPERSYNC 16KX18 64QFP

71

SN74ACT7805-25DL

SN74ACT7805-25DL

Texas Instruments

FIFO, 256X18, 15NS, SYNCHRONOUS

1154

CD40105BF

CD40105BF

Texas Instruments

CD40105B-MIL CMOS 4-BIT-BY-16-WO

131

CY7C4235V-15ASC

CY7C4235V-15ASC

IR (Infineon Technologies)

FIFO, 2KX18, 11NS, SYNCHRONOUS

2083

72261LA15TFGI

72261LA15TFGI

Renesas Electronics America

IC FIFO 8192X18 LP 15NS 64QFP

0

SN74ACT3638-20PCB

SN74ACT3638-20PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 512X32

281

SN74ALS236N

SN74ALS236N

Texas Instruments

FIFO, 64X4, 22NS, ASYNCHRONOUS,

3595

72125L25SOG

72125L25SOG

Renesas Electronics America

IC FIFO 1KX16 PAR-SER 28SOIC

0

CY7C43664-7AC

CY7C43664-7AC

Rochester Electronics

BI-DIRECTIONAL FIFO, 4KX36

30

72V211L15PFGI

72V211L15PFGI

Renesas Electronics America

IC FIFO SYNC 512X9 15NS 32-TQFP

0

QS7203-35V

QS7203-35V

FIFO, 2KX9, 35NS, ASYNCHRONOUS

125

QS72211-20JR

QS72211-20JR

FIFO, 512X9, 12NS, SYNCHRONOUS

392

SN74V3650-7PEU

SN74V3650-7PEU

Texas Instruments

FIFO, 2KX36, 5NS, SYNCHRONOUS

1261

CY7C409A-35DMB

CY7C409A-35DMB

Rochester Electronics

64 X 8 CAADABLE FIFO 64 X 9 CAAD

35

72V815L10PFG8

72V815L10PFG8

Renesas Electronics America

IC MEM FIFO 512X18 128TQFP

0

CY7C4255V-10ASC

CY7C4255V-10ASC

FIFO, 8KX18, 8NS, SYNCHRONOUS

6

AM7201-25JC

AM7201-25JC

FIFO, 512X9, 25NS, ASYNCHRONOUS

3658

SN74ACT7205L35NP

SN74ACT7205L35NP

Texas Instruments

FIFO, 8KX9, 35NS, ASYNCHRONOUS

2100

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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