Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
SN74ALVC3631-10PQ

SN74ALVC3631-10PQ

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36

0

CY7C4221-25JCT

CY7C4221-25JCT

Rochester Electronics

FIFO, 1KX9, 15NS, SYNCHRONOUS

750

SN74V235-10PAG

SN74V235-10PAG

Texas Instruments

SN74V235 2048 X 18 SYNCHRONOUS F

12190

SN74ACT7811-20PN

SN74ACT7811-20PN

Texas Instruments

FIFO, 1KX18, 20NS, SYNCHRONOUS

4110

SN74ABT7819-10PH

SN74ABT7819-10PH

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18, 9NS

2792

SN74ACT7881-30PN

SN74ACT7881-30PN

Texas Instruments

FIFO, 1KX18, 18NS, SYNCHRONOUS

11544

CY7C4231V-15JXC

CY7C4231V-15JXC

IR (Infineon Technologies)

FIFO, 2KX9, 11NS, SYNCHRONOUS

1352

SN74ACT72221L25RJ

SN74ACT72221L25RJ

Texas Instruments

FIFO MEM SYNC UNI-DIR 1K X 9

5968

SN74ACT2235-30FN

SN74ACT2235-30FN

Texas Instruments

BI-DIRECTIONAL FIFO, 1KX9

499

SN74ACT72221L50RJ

SN74ACT72221L50RJ

Texas Instruments

FIFO MEM SYNC UNI-DIR 1K X 9

3244

CY7C421-40JCT

CY7C421-40JCT

Rochester Electronics

FIFO, 512X9, 40NS, ASYNCHRONOUS

750

SN74ACT7206L15NP

SN74ACT7206L15NP

Texas Instruments

FIFO MEM ASYNC 16K X 9

3500

QS7201-20Q

QS7201-20Q

FIFO, 512X9, 20NS, ASYNCHRONOUS

1500

72V273L7-5PFGI

72V273L7-5PFGI

Renesas Electronics America

IC FIFO 16384X18 7-5NS 80QFP

0

QS725420A-25PF

QS725420A-25PF

QUALITY SEMI BI-DIR FIFO 512X36

678

SN74ACT7814-25DLR

SN74ACT7814-25DLR

Texas Instruments

FIFO, 64X18, 18NS, SYNCHRONOUS

250

CY7C421-40JC

CY7C421-40JC

Rochester Electronics

FIFO, 512X9, 40NS, ASYNCHRONOUS

2595

72V205L10PFG

72V205L10PFG

Renesas Electronics America

IC FIFO SYNC 16KX9 10NS 64QFP

0

SN74ALVC7814-40DL

SN74ALVC7814-40DL

Texas Instruments

IC 64X18 ASYNC FIFO MEM 56-SSOP

60

CY7C4245-15ASC

CY7C4245-15ASC

IR (Infineon Technologies)

FIFO, 4KX18, 10NS, SYNCHRONOUS

1090

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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