Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74LVC821DBLE Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES	5000
SN74LVCZ244AN Texas Instruments	IC BUFFER NON-INVERT 3.6V 20DIP	22100
SN74LVTH2952NSR Texas Instruments	IC TXRX NON-INVERT 3.6V 24SO	4000
SN74LVC1G240YEPR Texas Instruments	IC BUF INVERT 5.5V 5DSBGA/5WCSP	12000
SN74ALVTH16244KR Texas Instruments	IC BUFFER NON-INVERT 3.6V 56BGA	1000
CY74FCT2827CTQC Texas Instruments	BUS DRIVER, FCT SERIES	233
74LVC2G125DCTRE6 Texas Instruments	IC BUFFER NON-INVERT 5.5V SM8	557
SN74ACT373NE4 Texas Instruments	BUS DRIVER, ACT SERIES, 1-FUNC,	0
74LVTH16244ADGGRE4 Texas Instruments	IC BUF NON-INVERT 3.6V 48TSSOP	0
SN74AUP3G34DQER Texas Instruments	IC BUF NON-INVERT 3.6V 8X2SON	0
SN74LVC1G07YEPR Texas Instruments	IC BUFFER NON-INVERT 5.5V 5DSBGA	18000
SN74ALS244BN3 Texas Instruments	BUS DRIVER, 4-BIT, TTL	779
SN74BCT241N Texas Instruments	IC BUFFER NON-INVERT 5.5V 20DIP	8920
SN74ALS651-1NT3 Texas Instruments	BUS TRANSCEIVER, ALS SERIES	240
CD74HC240E Texas Instruments	IC BUFFER INVERT 6V 20DIP	6623
CY74FCT16646TPVCT Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	7850
SN74LVCH245ADW Texas Instruments	IC TXRX NON-INVERT 3.6V 20SOIC	924
SN74CBT3384DWR Texas Instruments	BUS DRIVER	20846
SNJ54ALS374FK Texas Instruments	BUS DRIVER, ALS SERIES	27
SN74F240N Texas Instruments	IC BUFFER INVERT 5.5V 20DIP	23641

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications