Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
CY74FCT16245TPACT Texas Instruments	IC TXRX NON-INVERT 5.5V 48TSSOP	23340
SN74ACT244MNSREP Texas Instruments	IC BUFFER NON-INVERT 5.5V 20SO	0
SN74AUP1G126YFPR Texas Instruments	IC BUFFER NON-INVERT 3.6V 6DSBGA	15000
SNJ54HC563FK Texas Instruments	BUS DRIVER, HC/UH SERIES	325
SN74ALVCH16646DL Texas Instruments	IC TXRX NON-INVERT 3.6V 56SSOP	19660
SN74ALS648ADW Texas Instruments	IC TXRX INVERT 5.5V 24SOIC	0
SN74LVC2G125DCT3 Texas Instruments	IC BUFFER NON-INVERT 5.5V SM8	2786
74AHC1G125DBVTE4 Texas Instruments	IC BUF NON-INVERT 5.5V SOT23-5	0
SN74LVC245AZQNR Texas Instruments	IC TXRX NON-INVERT 3.6V 20BGA	6399
SN74LV245ATDBR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SSOP	2000
74FCT162646ATPVCT Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	0
SN74AS622N Texas Instruments	BUS DRIVER/TRANSCEIVER	497
SN74AC240PWR Texas Instruments	IC BUFFER INVERT 6V 20TSSOP	1888
SN74AHCT16245DGVR Texas Instruments	IC TXRX NON-INVERT 5.5V 48TVSOP	6000
SN74AUC1G240YEPR Texas Instruments	IC BUF INVERT 2.7V 5DSBGA/5WCSP	3000
SN74LVC541DW Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES	6887
SN74LVT162244ADGG Texas Instruments	IC BUFF/DVR TRI-ST 16BIT 48TSSOP	7933
SN74LV244ATPWT Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	7250
SN74HCT245PWT Texas Instruments	IC TXRX NON-INVERT 5.5V 20TSSOP	2700
74AUP1G125DCKRG4 Texas Instruments	IC BUF NON-INVERT 3.6V SC70-5	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications