Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74LVCH8T245PWR Texas Instruments	IC TRANSLATION TXRX 5.5V 24TSSOP	8883
74ACT11821DW Texas Instruments	BUS DRIVER, ACT SERIES, 10-BIT	700
SN74BCT29846NT Texas Instruments	BUS DRIVER, BCT/FBT SERIES	465
SN74AHCT244DGVR Texas Instruments	IC BUF NON-INVERT 5.5V 20TVSOP	1666
CY74FCT2244ATQCTE4 Texas Instruments	IC BUF NON-INVERT 5.25V 20SSOP	0
SN74ALVTH162245VR Texas Instruments	IC TXRX NON-INVERT 3.6V 48TVSOP	357
SN74AHCT1G126DBVT Texas Instruments	IC BUF NON-INVERT 5.5V SOT23-5	3499
SN74LVC245AGQNR Texas Instruments	IC TXRX NON-INVERT 3.6V 20BGA	268837
SN74ABTH245DBRE4 Texas Instruments	IC TXRX NON-INVERT 5.5V 20SSOP	0
SN74ALVC16244AZQLR Texas Instruments	IC BUFFER NON-INVERT 3.6V 56BGA	0
74ACT11245NSR Texas Instruments	IC TXRX NON-INVERT 5.5V 24SO	4000
SN74F245DB Texas Instruments	BUS TRANSCEIVER	0
SNJ54HCT373W Texas Instruments	54HCT373 OCTAL D-TYPE TRANSPAREN	14
CY74FCT16952ATPVC Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	337
SN74LVTZ244DWR Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	36
SN74LVTH245APWE4 Texas Instruments	IC TXRX NON-INVERT 3.6V 20TSSOP	1277
SN74ALVC126D Texas Instruments	IC BUF NON-INVERT 3.6V 14SOIC	1035
SN74ALS645AN3 Texas Instruments	BUS TRANSCEIVER, ALS SERIES	520
SN74AUP1G07DCKT Texas Instruments	IC BUF NON-INVERT 3.6V SC70-5	1058
CLVTH16245AQDGGREP Texas Instruments	IC TXRX NON-INVERT 3.6V 48TSSOP	503

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications