Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
P8212 Rochester Electronics	OPTOELECTRONIC DEVICE	1206
2946DM/B Rochester Electronics	8-BIT BIDIRECTIONAL	77
2946/BRA Rochester Electronics	DUAL MARKED (5962-8672302RA)	974
MD82C288-8/B Rochester Electronics	BUS CONTROLLER	173
74HCT620N Rochester Electronics	OCTAL BUS TRANSCEIVER	2311
74HC659DW Rochester Electronics	IC TRANSCEIVER INVERT 6V	405
SN55325J Rochester Electronics	SN55325J	857
54LS54/BCA Rochester Electronics	DUAL MARKED (M38510/30402BCA)	861
54366AJ/B Rochester Electronics	HEX BUS DRIVERS W/3 STATE OUTPUT	531
2947/BRA Rochester Electronics	DUAL MARKED (5962-8672301RA)	609
DS7838J/B Rochester Electronics	BUS TRANSCEIVER	777
54LS646JT/B Rochester Electronics	SINGLE 8 BIT BUS TRANSCEIVER	101
MM54HC646J/883 Rochester Electronics	DUAL MARKED (5962-8688501LA)	994
54F181LM/B Rochester Electronics	SYNCHRONOUS 16 BIT TO 32 BIT MUL	0
2947PC Rochester Electronics	BUS TRANS; 8-BIT; BIDIRECTIONAL	976
MD82289-8 Rochester Electronics	80X86 BUS ARBITER	450
26S12APC Rochester Electronics	26S12APC	9931
CLC114A/BCA Rochester Electronics	DUAL MARKED (5962-9233901MCA)	102
54LS243/BCA Rochester Electronics	DUAL MARKED (M38510/32802BCA)	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications