Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
CY74FCT16245ETPAC Rochester Electronics	BUS TRANEIVER, FCT SERIES, 2 FUN	7203
IMIZ9952AAT Rochester Electronics	ZERO DELAY BUFFER 11-OUT SINGLE-	4000
54F573/BSA Rochester Electronics	DUAL MARKED (M38510/34604BSA)	573
DM7131J Rochester Electronics	IDENTITY COMPARATOR	1843
74ALS647-1NT Rochester Electronics	OCTAL BUS TRANSCEIVERS AND REGIS	727
54LS54/SDA Rochester Electronics	DUAL MARKED (M38510/30402SDA)	208
26S10/BFA Rochester Electronics	DUAL MARKED (5962-8672001FA)	879
MG82389 Rochester Electronics	MULTIBUS CONTROLLER, CMOS, CPGA1	0
54ACTQ245DM/B Rochester Electronics	BUS DRIVER/TRANSCEIVER, 1 FUNC,	6264
54ABT245/B2A Rochester Electronics	DUAL MARKED (5962-9214801Q2A)	1319
54ACTQ245/B2A Rochester Electronics	DUAL MARKED (5962-9218701M2A)	608
2946PC Rochester Electronics	BUS TRANS; 8-BIT; BIDIRECTIONAL	5419
74ACQ244SC-G Rochester Electronics	BUS DRIVER, AC SERIES, 2 FUNC, 4	5747
54F648/BLA Rochester Electronics	DUAL MARKED (5962-8975402LA)	930
54LS126A/BCA Rochester Electronics	DUAL MARKED (M38510/32302BCA)	944
54126W/B Rochester Electronics	QUAD BUS BUFFER GATES	401
54ACT11245JT/B Rochester Electronics	BUS TRANSCEIVER	139
54LS28/BCA Rochester Electronics	DUAL MARKED (M38510/30204BCA)	1351
74AS242N Rochester Electronics	QUAD BUS TRANSCEIVERS W/3 STATE	1647
MD82C288-10/R Rochester Electronics	CHMOS BUS CONTROLLER FOR M80286	4790

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications