Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
IMIZ9953AA Rochester Electronics	3.3V 180 MHZ, MULTI-OUTPUT ZERO	22554
CY74FCT16373CTPAC Rochester Electronics	BUS DRIVER, FCT SERIES, 2 FUNC,	1135
CY74FCT16373ETPACT Rochester Electronics	BUS DRIVER, FCT SERIES, 2 FUNC,	8000
54F374/BRA Rochester Electronics	DUAL MARKED (M3851034105BRA)	824
CY74FCT16827ETPVC Rochester Electronics	BUS DRIVER, FCT SERIES, 2 FUNC,	611
CY2302SZC-1T Rochester Electronics	FREQ MULTIPLIER + BUFFER	5000
DM8160N Rochester Electronics	MAGNITUDE COMPARATOR, 8160 SERIE	1316
CY74FCT16374ETPACT Rochester Electronics	BUS DRIVER, FCT SERIES, 2 FUNC,	8000
74FCT162H245CTPAC Rochester Electronics	IC TRANVR 16BIT N	8083
CY23S05SZC-1H Rochester Electronics	LOW-COST 3.3V SPREAD AWARE ZERO	3902
CY74FCT16652ETPVC Rochester Electronics	REGISTERED BUS TRANEIVER, FCT SE	681
74FCT162H245ETPACT Rochester Electronics	BUS TRANSCEIVER, FCT SERIES	36000
74FCT162374ETPACT Rochester Electronics	BUS DRIVER, FCT SERIES	16000
CY74FCT162244ETPAC Rochester Electronics	IC BUF NON-INVERT 5.5V 48TSSOP	16713
CY74FCT163827CPVC Rochester Electronics	BUS DRIVER, FCT SERIES, 2 FUNC,	2246
CY74FCT162245CTPAC Rochester Electronics	BUS TRANEIVER, FCT SERIES, 2 FUN	5427
IP82C83H Rochester Electronics	BUS DRIVER, CMOS SERIES, 1 FUNC,	244
CY2SSTV16859ZC Rochester Electronics	IC BUF NON-INVERT 2.7V 64TSSOP	3751
CY74FCT162646CTPAC Rochester Electronics	IC TXRX NON-INVERT 5.5V 56TSSOP	487
74FCT162827ETPVCT Rochester Electronics	BUS DRIVER, FCT SERIES	13000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications