Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LCXR162245MEA	IC TXRX NON-INVERT 3.6V 48SSOP	0
TC74AC640F(EL,F) Toshiba Electronic Devices and Storage Corporation	IC TRANSCEIVER INVERT 5.5V 20SOP	0
74FCT163245APAG8 Renesas Electronics America	IC TXRX NON-INVERT 3.6V 48TSSOP	0
MC74VHC540MEL	BUS DRIVER, AHC/VHC SERIES	2000
SN74F245DB Texas Instruments	BUS TRANSCEIVER	0
TC74AC244F(EL,F) Toshiba Electronic Devices and Storage Corporation	IC BUFFER NON-INVERT 5.5V 20SOP	0
FSTUD162450MTD	BUS DRIVER	1503
SNJ54HCT373W Texas Instruments	54HCT373 OCTAL D-TYPE TRANSPAREN	14
CY74FCT16952ATPVC Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	337
QS74FCT162543TPV	IC TRANSCEIVER NON-INVERT 5V	284
NLV27WZ17DFT2G Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 5.5V SC88	64
SN74LVTZ244DWR Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	36
SN74LVTH245APWE4 Texas Instruments	IC TXRX NON-INVERT 3.6V 20TSSOP	1277
SN74ALVC126D Texas Instruments	IC BUF NON-INVERT 3.6V 14SOIC	1035
SN74ALS645AN3 Texas Instruments	BUS TRANSCEIVER, ALS SERIES	520
SN74AUP1G07DCKT Texas Instruments	IC BUF NON-INVERT 3.6V SC70-5	1058
SN74LS240ML1	BUS DRIVER, 4-BIT, TTL	43000
CLVTH16245AQDGGREP Texas Instruments	IC TXRX NON-INVERT 3.6V 48TSSOP	503
SN74ALS747-1DW Texas Instruments	BUS DRIVER, ALS SERIES	1139
SN74ACT244DWRE4 Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications