Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74FCT3245PGG8 Renesas Electronics America	IC TXRX NON-INVERT 3.6V 20TSSOP	0
74HC1G125GW/S400125 NXP Semiconductors	IC BUFFER NON-INVERT 6V 5TSSOP	9000
MC74VHC541DWR2G	IC BUFFER NON-INVERT 5.5V 20SOIC	10265
74AXP1G125GNH NXP Semiconductors	IC BUFFER NON-INVERT 2.75V 6XSON	168840
SN75451BDE4 Texas Instruments	IC PERIPHERAL DRIVER 5.25V 8SOIC	0
FST16210MTD	BUS DRIVER	2660
CD4050BPWR Texas Instruments	IC BUFFER NON-INVERT 18V 16TSSOP	14956
74LVC2G07DW-7 Zetex Semiconductors (Diodes Inc.)	IC BUF NON-INVERT 5.5V SOT363	2147483647
SN74AUC17RGYR Texas Instruments	IC BUFFER NON-INVERT 2.7V 14VQFN	1967
MM74HC245AMTCX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 6V 20TSSOP	2675
CD74ACT652M	IC TXRX NON-INVERT 5.5V 24SOIC	5663
74ACQ244PC	IC BUFFER NON-INVERT 6V 20DIP	6078
SN74LVC125DR Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES	14651
SN64BCT757DWR Texas Instruments	IC BUFFER NON-INVERT 5.5V 20SOIC	1940
SN74LS241ML1	OCTAL BUS DRIVER	0
SN74LVCH8T245PWR Texas Instruments	IC TRANSLATION TXRX 5.5V 24TSSOP	8883
74ACT11821DW Texas Instruments	BUS DRIVER, ACT SERIES, 10-BIT	700
SN74BCT29846NT Texas Instruments	BUS DRIVER, BCT/FBT SERIES	465
74LVC2G125GD,125 Nexperia	IC BUFFER NON-INVERT 5.5V 8XSON	514953
SN74LS640MR1	BUS TRANSCEIVER, LS SERIES TTL	75000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications