Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
CD74HCT540E Texas Instruments	IC BUFFER INVERT 5.5V 20DIP	10177
CD74HCT646E	IC TXRX NON-INVERT 5.5V 24DIP	4690
SNJ54HC367J Texas Instruments	54HC367 HEX BUS DRIVERS WITH 3-S	0
SN74BCT245PW Texas Instruments	IC TXRX NON-INVERT 5.5V 20TSSOP	6090
DM54LS125AW/883	BUS DRIVER, LS SERIES	657
5962-8776701SA Texas Instruments	BUS DRIVER, AS SERIES	91
CD74HC243M Texas Instruments	IC TXRX NON-INVERT 6V 14SOIC	105110000
SN74ABT125DBR Texas Instruments	IC BUF NON-INVERT 5.5V 14SSOP	958
SN74AS230AN Texas Instruments	BUS DRIVER, AS SERIES	0
V62/04620-01XE Texas Instruments	SN74ACT244-EP ENHANCED PRODUCT O	550
74AHC573PW-Q100118 NXP Semiconductors	BUS DRIVER, AHC/VHC/H/U/V SERIES	5463
74VHC541M	IC BUFFER NON-INVERT 5.5V 20SOIC	72018
SN74ALS29828NT Texas Instruments	BUS DRIVER, ALS SERIES	5869
MC74LCX244DTR2G Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 20TSSOP	1578
74AHC1G17GV125 NXP Semiconductors	74AHC1G17 BUFFER	349990
74LVXC4245QSC	IC TXRX NON-INVERT 5.5V 24QSOP	11722
74ACT16827DL Texas Instruments	IC BUFFER NON-INVERT 5.5V 56SSOP	2890
FXL4T245BQX Sanyo Semiconductor/ON Semiconductor	IC TRANSLATION TXRX 3.6V 14DQFN	4900
SN74ACT563DBLE Texas Instruments	BUS DRIVER, ACT SERIES, 8-BIT	4000
MC74ACT533DW	BUS DRIVER, ACT SERIES, 1 FUNC,	1482

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications