Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74ALVC162244GX	IC BUFFER NON-INVERT 3.6V 54FBGA	7500
SN74CBT3245DBLE Texas Instruments	BUS DRIVER	25000
SN74ALVCHR162245DL Texas Instruments	IC TXRX NON-INVERT 3.6V 48SSOP	4364
DM7008W/883	DM7008W/883	0
74AUP2G241GN,115 Nexperia	IC BUFFER NON-INVERT 3.6V 8XSON	0
74LVTH162244MEX	IC BUFFER NON-INVERT 3.6V 48SSOP	54879
SN74BCT623N Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	8933
NC7SP125L6X Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 6MICROPAK	478950000
MAX7482ETI+ Analog Devices, Inc.	BUFFER/INVERTER BASED PERIPHERAL	4250
MM74HCT541SJ	IC BUFFER NON-INVERT 5.5V 20SOP	4165
MM74HC4050MTC	IC BUFFER NON-INVERT 6V 16TSSOP	1237
74FR16540SSC	BUS DRIVER	1218
SN74ABT241AN Texas Instruments	IC BUFFER NON-INVERT 5.5V 20DIP	27360
SN74ALVCH16952DLR Texas Instruments	IC TXRX NON-INVERT 3.6V 56SSOP	28000
74HC7540DB,118 Nexperia	IC BUFFER INVERT 6V 20SSOP	6901
SN74LS245NSR Texas Instruments	IC TXRX NON-INVERT 5.25V 20SO	32302
MC74F534DW	BUS TRANSCEIVER	0
CY74FCT541CTQCT Texas Instruments	IC BUF NON-INVERT 5.25V 20SSOP	106760
SN74LVTH126DGVR Texas Instruments	IC BUF NON-INVERT 3.6V 14TVSOP	37497
MC74ACT241M	IC BUFF/DVR TRI-ST DUAL 20SOEIAJ	16289

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications