Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
NTE74HCT240 NTE Electronics, Inc.	IC BUF/DRIVER 5.5V 20DIP	116
SN74ABT5403DWR Texas Instruments	IC BUFFER INVERT 5.5V 28SOIC	2780
SN74LS645N3 Texas Instruments	BUS TRANSCEIVER, LS SERIES TTL	1220
74LVC1G126GS,132 Nexperia	IC BUFFER NON-INVERT 5.5V 6XSON	284980
9009FM	NAND BUFFER 4-INPUT GATE, TTL	395
74AUP1G07GX4Z Nexperia	IC BUFFER NON-INVERT 3.6V 4X2SON	8560
SN74ABTH245PWR Texas Instruments	IC TXRX NON-INVERT 5.5V 20TSSOP	2008
SN74AVCH4T245PWE4 Texas Instruments	IC TRANSLATION TXRX 3.6V 16TSSOP	0
SN74CBTS3384PWLE Texas Instruments	BUS DRIVER	2000
CY74FCT16543ETPAC Rochester Electronics	REGISTERED BUS TRANEIVER, FCT SE	12555
SN74LVC3G17YZPR Texas Instruments	IC BUF NON-INVERT 5.5V 8DSBGA	8071
SN74LVTH2245PW Texas Instruments	IC TXRX NON-INVERT 3.6V 20TSSOP	528
74LVCH16245APVG8 Renesas Electronics America	IC TXRX NON-INVERT 3.6V 48SSOP	607
74HC7541D,112 Nexperia	IC BUFFER NON-INVERT 6V 20SO	124
SN74ALS541NS Texas Instruments	IC BUFFER NON-INVERT 5.5V 20SO	287
74LV241PW,112 NXP Semiconductors	IC BUF NON-INVERT 3.6V 20TSSOP	0
AM29C821AJC	BUS DRIVER SERIES, 10-BIT	2776
74AHC2G126GD,125 Nexperia	IC BUFFER NON-INVERT 5.5V 8XSON	97224
74HC126S14-13 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 6V 14SO	1704
SN74ABT125N Texas Instruments	IC BUF NON-INVERT 5.5V 14DIP	885

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications