Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74LVC245ADBR Texas Instruments	IC TXRX NON-INVERT 3.6V 20SSOP	2430
NC7WZ240K8X Sanyo Semiconductor/ON Semiconductor	IC BUFFER INVERT 5.5V US8	1733
SN74AS757DWE4 Texas Instruments	IC BUFFER NON-INVERT 5.5V 20SOIC	95
SN74ABT244APWR Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	6691
SN74AUC2G07DCKRE4 Texas Instruments	IC BUFFER NON-INVERT 2.7V SC70-6	0
SN754410NEE4 Texas Instruments	IC HALF-H DRIVER 5.5V 16DIP	582
SN74HC241PWRE4 Texas Instruments	IC BUFFER NON-INVERT 6V 20TSSOP	0
CY74FCT162374ATPAC Rochester Electronics	BUS DRIVER, FCT SERIES, 2 FUNC,	5936
SN74HC240ANSR Texas Instruments	IC BUFFER INVERT 6V 20SO	1997
74LVC2G240GM,125 NXP Semiconductors	IC BUFFER INVERT 5.5V 8XQFN	55600
SN74LVC1G17DCKTG4 Texas Instruments	IC BUF NON-INVERT 5.5V SC70-5	0
SN74AUP3G07DQER Texas Instruments	IC BUFFER NON-INVERT 3.6V 8X2SON	35000
SN74LVC244APWT Texas Instruments	IC BUF NON-INVERT 3.6V 20TSSOP	3505
SN74ALS29827DWR Texas Instruments	IC BUF NON-INVERT 5.25V 24SOIC	4000
74LVC2G125GN/S505115 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	18000
8407101SA Texas Instruments	SN54HC374 OCTAL D-TYPE EDGE-TRIG	26
SN74LS365AN3 Texas Instruments	BUS DRIVER, LS SERIES	625
SN74ALS244CN Texas Instruments	IC BUF NON-INVERT 5.5V 20DIP	659
SN74HCT645NE4 Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	1000
74LVC1G125GF/S505125 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	6243

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications