Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74ABT244ADW Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	861
MC74VHCT245ADWRG	IC TXRX NON-INVERT 5.5V 20SOIC	4049
SN74ABT646ADWR Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	2000
SNJ54F373J Texas Instruments	54F373 - OCTAL TRANSPARENT LATCH	624
TC7SZ07FE,LJ(CT Toshiba Electronic Devices and Storage Corporation	IC BUFFER NON-INVERT 5.5V ESV	2392
SN74LVCR32245AZKER Texas Instruments	IC TXRX NON-INVERT 3.6V 96PBGA	69330
74VHC245D,118 Nexperia	IC TXRX NON-INVERT 5.5V 20SO	1982
SN74ABT244APWRE4 Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	0
74HC125DR2G	IC BUFFER NON-INVERT 6V 14SOIC	78121
SN74AS240ANSR Texas Instruments	IC BUFFER INVERT 5.5V 20SO	17538
CY74FCT2245TSOCTG4 Texas Instruments	IC TXRX NON-INVERT 5.25V 20SOIC	0
74LCX245WMX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 3.6V 20SOIC	56919000
SN74LVTH16240DLR Texas Instruments	IC BUFFER INVERT 3.6V 48SSOP	940
SN74LVC646ADBR Texas Instruments	IC TXRX NON-INVERT 3.6V 24SSOP	2740
QS74FCT16374ATPV	IC ADDRESS DRIVER 5V 4 FUNCTION	26105
QS74FCT2841BTP	BUS DRIVER, FCT SERIES	0
74LV244U/S400029 NXP Semiconductors	BUS DRIVER, LV/LV-A/LVX/H SERIES	7000
SN74AHC125QDRQ1 Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SOIC	3700
IP82C82	CMOS OCTAL LATCHING BUS DRIVER	95
SN74HCT244PWG4 Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications