Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
NLU2G17MUTCG Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 5.5V 6UDFN	99036000
74ABT16240ADGG,118 Nexperia	IC BUFFER INVERT 5.5V 48TSSOP	0
TC74HC4050AFTEL Toshiba Electronic Devices and Storage Corporation	IC BUFFER NON-INVERT 6V 16TSSOP	0
74AHC541D,118 Nexperia	IC BUFFER NON-INVERT 5.5V 20SO	437
CD74HCT541M96E4 Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	0
SN74ABT543ADBRG4 Texas Instruments	IC TXRX NON-INVERT 5.5V 24SSOP	0
74AHCT245BQ-Q100115 NXP Semiconductors	BUS TRANSCVR	21000
74ALVCH16827DGG112 NXP Semiconductors	BUS DRIVER, ALVC/VCX/A SERIES	1740
CY74FCT162374ETPAC Texas Instruments	BUS DRIVER, FCT SERIES	6400
100322PC	BUFFER, 100K SERIES	1060
74LCX125M Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 14SOIC	1623100
74LVC2G07GF,132 Nexperia	IC BUFFER NON-INVERT 5.5V 6XSON	5971
74LVC3G07GS,115 Nexperia	IC BUFFER NON-INVERT 5.5V 8XSON	3886
SN74BCT126AD Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SOIC	15284
QS3L383S0	BUS EXCHANGER, 10 BIT, TRUE OUT	0
74HC244PW,118 Nexperia	IC BUFFER NON-INVERT 6V 20TSSOP	3519
M74VHC1GT126DF1G Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 5.5V SC88A	1644
74LVQ245SCX	IC TXRX NON-INVERT 3.6V 20SOIC	4000
MC74LCX646DT	REGISTERED BUS TRANSCEIVER	1450
CD74HCT243EE4 Texas Instruments	IC TXRX NON-INVERT 5.5V 14DIP	760

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications