Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74HCT541PW Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	376
SN74S240DW Texas Instruments	IC BUFFER INVERT 5.25V 20SOIC	13299
54LS374LMQB	BUS DRIVER, LS SERIES TTL	197
SN74LVC244ADWR Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	7345
CY74FCT162501ETPAC Texas Instruments	BUS TRANSCEIVER, FCT SERIES	6002
SNJ55326W Texas Instruments	BUS DRIVER, TTL	4307
74FCT162827CTPAG8 Renesas Electronics America	IC BUF NON-INVERT 5.5V 56TSSOP	0
SN74AC245NSR Texas Instruments	IC TXRX NON-INVERT 6V 20SO	1184
CD74HCT240M96 Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	603
5962-8685601RA Texas Instruments	CD54HCT573 HIGH SPEED CMOS LOGIC	246
74AHCT541BQ,115 Nexperia	IC BUF NON-INVERT 5.5V 20DHVQFN	481
SN74ALVC245DWR Texas Instruments	IC TXRX NON-INVERT 3.6V 20SOIC	445
SN74LVC16646ADGGR Texas Instruments	IC TXRX NON-INVERT 3.6V 56TSSOP	41699
74AHCT1G126GF,132 Nexperia	IC BUFFER NON-INVERT 5.5V 6XSON	3845
74LVTH16245ADGGRG4 Texas Instruments	IC TXRX NON-INVERT 3.6V 48TSSOP	0
NL17SZ07DFT2G Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 5.5V SC88A	1919492000
74LVCH162244ADL:11 Nexperia	IC BUF NON-INVERT 3.6V 48SSOP	0
74FCT3244SOG8 Renesas Electronics America	IC BUF NON-INVERT 3.6V 20SOIC	0
74ACT16240SSC	IC BUFFER INVERT 5.5V 48SSOP	2002
CD74HC4050PWRG4 Texas Instruments	IC BUFFER NON-INVERT 6V 16TSSOP	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications