Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74LVC240APWRG4 Texas Instruments	IC BUFFER INVERT 3.6V 20TSSOP	4490
MC74ACT241DWR2	IC BUFFER NON-INVERT 5.5V 20SOIC	3000
74AUP3G16GMH Nexperia	IC BUFFER NON-INVERT 3.6V 8XQFN	4000
SN74HC540NS Texas Instruments	IC BUFFER INVERT 6V 20SO	1644
MC74HCT241ADTG Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 20TSSOP	1459
CY74FCT541CTSOCT Texas Instruments	IC BUF NON-INVERT 5.25V 20SOIC	22559
FSTUD162450MTDX	BUS DRIVER	3589
SN74LVCH245DW Texas Instruments	BUS TRANSCEIVER	4375
SN74LV244APWRG3 Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	7376
SN74ALS645A-1DWG4	IC TXRX NON-INVERT 5.5V 20SOIC	225
CD74ACT541SM96 Texas Instruments	IC BUF NON-INVERT 5.5V 20SSOP	1261
SN74LS243N Texas Instruments	SN74LS243 QUAD BUS TRANSCEIVERS	3823
74LVC244AQ20-13 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 3.6V 20DFN	1130
MC74VHC1GT125MU3TCG Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 5.5V 6UDFN	0
74AUP1G07GN,132 Nexperia	IC BUFFER NON-INVERT 3.6V 6XSON	4685
74AHCT2G125DP,125 Nexperia	IC BUF NON-INVERT 5.5V 8TSSOP	5801
SN74ABT2240APWRE4 Texas Instruments	IC BUFFER INVERT 5.5V 20TSSOP	2000
CD54AC573F3A Texas Instruments	CD54AC573 NON-INVERTING OCTAL TR	2
NLU1GT126BMX1TCG	IC BUFFER NON-INVERT 5.5V 6ULLGA	75000
74ACTQ16240SSCX	IC BUFFER INVERT 5.5V 48SSOP	2000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications